Inventor · disambiguated record
Keiji Shinyama
Also filed as: SHINYAMA KEIJI
2 granted patents·2 pending applications·13 citations·filing 2004–2011
50Inventor score
Top patents by PatentIndex Score
4 records- 0162US7030496B2Semiconductor device having aluminum and metal electrodes and method for manufacturing the sameDENSO CORP·Filed 2004·Granted Apr 18, 2006·13 cites·16 claims
- 0243US8932440B2Plating apparatus and plating methodSHINYAMA KEIJI·Filed 2011·Granted Jan 13, 2015·0 cites·7 claims
- 0338US2006081996A1Semiconductor device having aluminum electrode and metallic electrodeDENSO CORP·Filed 2005·Application pending·0 cites
- 0434US2005034526A1Semiconductor sensor and method of plating semiconductor devicesDENSO CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →