Inventor · disambiguated record
Kuei-Wu Chu
Also filed as: CHU KUEI-WU
3 granted patents·6 pending applications·3 citations·filing 2010–2012
52Inventor score
Top patents by PatentIndex Score
9 records- 0157US8299629B2Wafer-bump structureCHU KUEI-WU·Filed 2011·Granted Oct 30, 2012·3 cites·9 claims
- 0233US8184464B2Flash memoryCHU KUEI-WU·Filed 2010·Granted May 22, 2012·0 cites·8 claims
- 0331US2012181065A1Multi-Layered Circuit Board DeviceCHU KUEI-WU·Filed 2011·Application pending·0 cites
- 0427US8424357B2Easily stackable diesLU LEO·Filed 2010·Granted Apr 23, 2013·0 cites·8 claims
- 0526US2011062590A1Chip Stacking Device Having Re-Distribution LayerMAO BANG ELECTRONIC CO LTD·Filed 2010·Application pending·0 cites
- 0626US2011108983A1Integrated CircuitMAO BANG ELECTRONIC CO LTD·Filed 2010·Application pending·0 cites
- 0726US2011062586A1Chip for Reliable Stacking on another ChipMAO BANG ELECTRONIC CO LTD·Filed 2010·Application pending·0 cites
- 0823US2012074558A1Circuit Board Packaged with Die through Surface Mount TechnologyLU HSUAN YU·Filed 2011·Application pending·0 cites
- 0921US2015235978A1Electroless nickel bump of die pad and manufacturing method thereofAFLASH TECHNOLOGY CO LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →