Inventor · disambiguated record
Steven Reder
Also filed as: REDER STEVEN · REDER STEVEN E
22 granted patents·11 pending applications·366 citations·filing 1990–2013
95Inventor score
Top patents by PatentIndex Score
33 records- 0195US6837967B1Method and apparatus for cleaning deposited films from the edge of a waferLSI LOGIC CORP·Filed 2002·Granted Jan 4, 2005·107 cites·26 claims
- 0288US8653357B2Method for heat dissipation on semiconductor deviceLSI CORP·Filed 2013·Granted Feb 18, 2014·10 cites·4 claims
- 0388US7332062B1Electroplating tool for semiconductor manufacture having electric field controlLSI LOGIC CORP·Filed 2003·Granted Feb 19, 2008·23 cites·19 claims
- 0486US6739953B1Mechanical stress free processing methodLSI LOGIC CORP·Filed 2003·Granted May 25, 2004·37 cites·20 claims
- 0584US6874510B2Method to use a laser to perform the edge clean operation on a semiconductor waferLSI LOGIC CORP·Filed 2003·Granted Apr 5, 2005·27 cites·13 claims
- 0675US6982206B1Mechanism for improving the structural integrity of low-k filmsLSI LOGIC CORP·Filed 2003·Granted Jan 3, 2006·20 cites·19 claims
- 0774US6649537B1Intermittent pulsed oxidation processLSI LOGIC CORP·Filed 2001·Granted Nov 18, 2003·16 cites·18 claims
- 0872US6650958B1Integrated process tool monitoring system for semiconductor fabricationLSI LOGIC CORP·Filed 2002·Granted Nov 18, 2003·20 cites·13 claims
- 0970US5146869ATube and injector for preheating gases in a chemical vapor deposition reactorNAT SEMICONDUCTOR CORP·Filed 1990·Granted Sep 15, 1992·42 cites·11 claims
- 1063US7198546B2Method to monitor pad wear in CMP processingLSI LOGIC CORP·Filed 2004·Granted Apr 3, 2007·10 cites·3 claims
- 1160US8404960B2Method for heat dissipation on semiconductor devicePRATHER ZACHARY A·Filed 2004·Granted Mar 26, 2013·11 cites·4 claims
- 1256US2006219572A1Abrasive ElectrolyteLSI LOGIC CORP·Filed 2006·Application pending·0 cites
- 1355US2006185986A1Method to improve the control of electro-polishing by use of a plating electrode in an electrolyte bathLSI LOGIC CORP·Filed 2006·Application pending·0 cites
- 1454US6635116B1Residual oxygen reduction systemLSI LOGIC CORP·Filed 2000·Granted Oct 21, 2003·5 cites·11 claims
- 1554US2006137993A1Process method for achieving uniform stress free electro-polishing across a copper plated waferLSI LOGIC CORP·Filed 2006·Application pending·0 cites
- 1653US6355577B1System to reduce particulate contaminationLSI LOGICE CORP·Filed 2000·Granted Mar 12, 2002·7 cites·10 claims
- 1752US7067048B2Method to improve the control of electro-polishing by use of a plating electrode an electrolyte bathLSI LOGIC CORP·Filed 2003·Granted Jun 27, 2006·0 cites·5 claims
- 1852US6328347B1Uniform axial loading ground glass joint clampLSI LOGIC CORP·Filed 1999·Granted Dec 11, 2001·20 cites·20 claims
- 1951US6574525B1In situ measurementLSI LOGIC CORP·Filed 2002·Granted Jun 3, 2003·3 cites·20 claims
- 2051US2005087451A1Abrasive electrolyteFiled 2003·Application pending·0 cites
- 2150US6971944B2Method and control system for improving CMP process by detecting and reacting to harmonic oscillationLSI LOGIC CORP·Filed 2004·Granted Dec 6, 2005·3 cites·22 claims
- 2250US2004245119A1Process method for achieving uniform stress free electro-polishing across a copper plated waferFiled 2003·Application pending·0 cites
- 2349US6869893B2Laminate low K filmLSI LOGIC CORP·Filed 2002·Granted Mar 22, 2005·2 cites·16 claims
- 2447US7314527B1Reactor systemLSI LOGIC CORP·Filed 2001·Granted Jan 1, 2008·3 cites·19 claims
- 2544US2005109369A1Method to use a laser to perform the edge clean operation on a semiconductor waferLSI LOGIC CORP·Filed 2004·Application pending·0 cites
- 2642US6927177B2Chemical mechanical electropolishing systemLSI LOGIC CORP·Filed 2003·Granted Aug 9, 2005·0 cites·13 claims
- 2740US7183787B2Contact resistance device for improved process controlLSI LOGIC CORP·Filed 2003·Granted Feb 27, 2007·0 cites·18 claims
- 2839US6743701B1Method for the formation of active area utilizing reverse trench isolationLSI LOGIC CORP·Filed 2002·Granted Jun 1, 2004·0 cites·15 claims
- 2938US2005258044A1Magnetic focus rings for improved copper platingBERMAN MICHAEL J·Filed 2004·Application pending·0 cites
- 3038US2004086430A1Residual oxygen reduction systemLSI LOGIC CORP·Filed 2003·Application pending·0 cites
- 3138US2005037620A1Method for achieving wafer contact for electro-processingFiled 2003·Application pending·0 cites
- 3238US2005087450A1Electropolishing padFiled 2003·Application pending·0 cites
- 3337US2003211811A1Adaptable multi zone carrierFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →