Inventor · disambiguated record
Seung Ouk Jung
Also filed as: JUNG SEUNG OUK
2 granted patents·191 citations·filing 2000–2002
71Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0193US6455408B1Method for manufacturing semiconductor devices having redistribution patterns with a concave pattern in a bump pad areaSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Sep 24, 2002·134 cites·6 claims
- 0287US6621164B2Chip size package having concave pattern in the bump pad area of redistribution patterns and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Sep 16, 2003·57 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →