Inventor · disambiguated record
Jack Eng
Also filed as: ENG JACK
6 granted patents·1 pending application·125 citations·filing 1995–2002
83Inventor score
Top patents by PatentIndex Score
7 records- 0188US6489660B1Low-voltage punch-through bi-directional transient-voltage suppression devicesGEN SEMICONDUCTOR INC·Filed 2001·Granted Dec 3, 2002·59 cites·9 claims
- 0274US5882986ASemiconductor chips having a mesa structure provided by sawingGEN SEMICONDUCTOR INC·Filed 1998·Granted Mar 16, 1999·48 cites·9 claims
- 0351US6602769B2Low-voltage punch-through bi-directional transient-voltage suppression devices and methods of making the sameGEN SEMICONDUCTOR INC·Filed 2002·Granted Aug 5, 2003·5 cites·9 claims
- 0444US5640043AHigh voltage silicon diode with optimum placement of silicon-germanium layersGEN INSTRUMENT CORP·Filed 1995·Granted Jun 17, 1997·10 cites·15 claims
- 0531US6248651B1Low cost method of fabricating transient voltage suppressor semiconductor devices or the likeGEN SEMICONDUCTOR INC·Filed 1998·Granted Jun 19, 2001·3 cites·16 claims
- 0630US2004075160A1Transient voltage suppressor having an epitaxial layer for higher avalanche voltage operationFiled 2002·Application pending·0 cites
- 0727US5635414ALow cost method of fabricating shallow junction, Schottky semiconductor devicesFiled 1995·Granted Jun 3, 1997·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →