Inventor · disambiguated record
Masayoshi Kohinata
Also filed as: KOHINATA MASAYOSHI
4 granted patents·1 pending application·52 citations·filing 1993–2005
73Inventor score
Top patents by PatentIndex Score
5 records- 0181US5451279AMethod for joining ceramic sintered bodiesMITSUBISHI MATERIALS CORP·Filed 1993·Granted Sep 19, 1995·35 cites·4 claims
- 0271US7556669B2Au-sn alloy powder for solder pasteMITSUBISHI MATERIALS CORP·Filed 2005·Granted Jul 7, 2009·3 cites·1 claims
- 0354US8721961B2Au—Sn alloy bump including no large void and method of producing sameMASAYUKI ISHIKAWA·Filed 2005·Granted May 13, 2014·0 cites·7 claims
- 0446US5651873AElectroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surfaceMITSUBISHI MATERIALS CORP·Filed 1995·Granted Jul 29, 1997·14 cites·15 claims
- 0530US2006113006A1Tin-containing plating bathMASUDA AKIHIRO·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →