Inventor · disambiguated record
Yasushi Aiba
Also filed as: AIBA YASUSHI
10 granted patents·4 pending applications·39 citations·filing 2000–2016
86Inventor score
Top patents by PatentIndex Score
14 records- 0191US9536782B2Tungsten film forming method, semiconductor device manufacturing method, and storage mediumTOKYO ELECTRON LTD·Filed 2015·Granted Jan 3, 2017·9 cites·7 claims
- 0285US10026616B2Method of reducing stress in metal film and metal film forming methodTOKYO ELECTRON LTD·Filed 2016·Granted Jul 17, 2018·4 cites·21 claims
- 0385US9472454B2Tungsten film forming methodTOKYO ELECTRON LTD·Filed 2015·Granted Oct 18, 2016·5 cites·10 claims
- 0484US9536745B2Tungsten film forming methodTOKYO ELECTRON LTD·Filed 2016·Granted Jan 3, 2017·5 cites·18 claims
- 0574US9938620B2Gas supply mechanism, gas supplying method, film forming apparatus and film forming method using the sameTOKYO ELECTRON LTD·Filed 2015·Granted Apr 10, 2018·1 cites·9 claims
- 0667US10131986B2Method of forming metal filmTOKYO ELECTRON LTD·Filed 2016·Granted Nov 20, 2018·1 cites·11 claims
- 0762US7718005B2Film forming equipment and film forming methodTOKYO ELECTRON LTD·Filed 2005·Granted May 18, 2010·2 cites·19 claims
- 0857US8168539B2Method for forming tungsten film at a surface of a processing target material, film-forming apparatus, storage medium and semiconductor device with a tungsten filmSUGIURA MASAHITO·Filed 2006·Granted May 1, 2012·3 cites·7 claims
- 0951US6625862B2Method of manufacturing a processing apparatusHITACHI LTD·Filed 2000·Granted Sep 30, 2003·6 cites·6 claims
- 1049US6387445B1Tungsten layer forming method and laminate structure of tungsten layerTOKYO ELECTRON LTD·Filed 2000·Granted May 14, 2002·3 cites·7 claims
- 1143US2016379879A1Tungsten film forming methodTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 1242US2016040287A1Tungsten Film Forming MethodTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
- 1341US2009302024A1Heat Processing Method and Heat Processing ApparatusAIBA YASUSHI·Filed 2006·Application pending·0 cites
- 1437US2003205192A1Film forming methodTOKYO ELECTRON LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →