Inventor · disambiguated record
Wen-Long Lee
Also filed as: LEE WEN-LONG
14 granted patents·2 pending applications·43 citations·filing 2001–2024
89Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8TAIWAN SEMICONDUCTOR MFG5CHANG JEN-CHI1CHIANG CHIH-WEI1WU WEI CHING1
Top patents by PatentIndex Score
16 records- 0186US7635651B2Method of smoothening dielectric layerTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Dec 22, 2009·12 cites·20 claims
- 0283US12020905B2Method of using high density plasma chemical vapor deposition chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 0383US9941100B2Adjustable nozzle for plasma deposition and a method of controlling the adjustable nozzleWU WEI CHING·Filed 2011·Granted Apr 10, 2018·3 cites·14 claims
- 0481US9716044B2Interlayer dielectric structure with high aspect ratio process (HARP)CHANG JEN-CHI·Filed 2011·Granted Jul 25, 2017·6 cites·20 claims
- 0578US11342164B2High density plasma chemical vapor deposition chamber and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 24, 2022·0 cites·20 claims
- 0678US7851358B2Low temperature method for minimizing copper hillock defectsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Dec 14, 2010·8 cites·20 claims
- 0767US9349733B2Gate structure having spacer with flat top surface and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 24, 2016·2 cites·20 claims
- 0863US10910199B2Method of controlling an adjustable nozzle and method of making a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 2, 2021·0 cites·20 claims
- 0963US6585826B2Semiconductor wafer cleaning method to remove residual contamination including metal nitride particlesTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 1, 2003·10 cites·7 claims
- 1060US7611589B2Methods of spin-on wafer cleaningTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 3, 2009·1 cites·14 claims
- 1160US7368383B2Hillock reduction in copper filmsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted May 6, 2008·1 cites·15 claims
- 1260US2025351448A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1359US2025393270A1Semiconductor devices with epitaxial source/drain region with a bottom dielectric layer and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1448US9048185B2Profile pre-shaping for replacement poly gate interlayer dielectricTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 2, 2015·0 cites·20 claims
- 1540US8803249B2Profile pre-shaping for replacement poly gate interlayer dielectricCHIANG CHIH-WEI·Filed 2012·Granted Aug 12, 2014·0 cites·19 claims
- 1634US9859137B2Substrate heat treatment apparatus and heat treatment methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 2, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →