Inventor · disambiguated record
Scott I. Langenthal
Also filed as: LANGENTHAL SCOTT · LANGENTHAL SCOTT I · LANGENTHAL SCOTT IRA
12 granted patents·445 citations·filing 1998–2003
93Inventor score
Files withIBM12
Top patents by PatentIndex Score
12 records- 0190US6529021B1Self-scrub buckling beam probeIBM·Filed 2000·Granted Mar 4, 2003·54 cites·16 claims
- 0289US6136419ACeramic substrate having a sealed layerIBM·Filed 1999·Granted Oct 24, 2000·74 cites·29 claims
- 0388US6184062B1Process for forming cone shaped solder for chip interconnectionIBM·Filed 1999·Granted Feb 6, 2001·56 cites·71 claims
- 0487US6312791B1Multilayer ceramic substrate with anchored padIBM·Filed 2000·Granted Nov 6, 2001·36 cites·19 claims
- 0587US6139666AMethod for producing ceramic surfaces with easily removable contact sheetsIBM·Filed 1999·Granted Oct 31, 2000·88 cites·7 claims
- 0685US6559527B2Process for forming cone shaped solder for chip interconnectionIBM·Filed 2001·Granted May 6, 2003·28 cites·20 claims
- 0780US6187418B1Multilayer ceramic substrate with anchored padIBM·Filed 1999·Granted Feb 13, 2001·40 cites·35 claims
- 0869US6220499B1Method for assembling a chip carrier to a semiconductor deviceIBM·Filed 1998·Granted Apr 24, 2001·30 cites·7 claims
- 0966US6984792B2Dielectric interposer for chip to substrate solderingIBM·Filed 2003·Granted Jan 10, 2006·9 cites·14 claims
- 1052US6258191B1Method and materials for increasing the strength of crystalline ceramicIBM·Filed 1998·Granted Jul 10, 2001·18 cites·7 claims
- 1139US6657313B1Dielectric interposer for chip to substrate solderingIBM·Filed 1999·Granted Dec 2, 2003·7 cites·12 claims
- 1235US6376054B1Surface metallization structure for multiple chip test and burn-inIBM·Filed 1999·Granted Apr 23, 2002·5 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →