Inventor · disambiguated record
Chih-Hong Chuang
Also filed as: CHUANG CHIH-HONG
6 granted patents·4 pending applications·10 citations·filing 2010–2017
73Inventor score
Top patents by PatentIndex Score
10 records- 0178US8390013B2Semiconductor package structure and fabricating method of semiconductor package structureTSENG TZYY-JANG·Filed 2010·Granted Mar 5, 2013·5 cites·5 claims
- 0275US8510936B2Manufacturing method of package carrierCHUANG CHIH-HONG·Filed 2010·Granted Aug 20, 2013·5 cites·20 claims
- 0349US10123413B2Package substrate and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2017·Granted Nov 6, 2018·0 cites·12 claims
- 0447US8563363B2Fabricating method of semiconductor package structureTSENG TZYY-JANG·Filed 2012·Granted Oct 22, 2013·0 cites·14 claims
- 0545US9693468B2Package substrate and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2015·Granted Jun 27, 2017·0 cites·7 claims
- 0644US9603263B2Manufacturing method of circuit substrateCHUANG CHIH-HONG·Filed 2012·Granted Mar 21, 2017·0 cites·8 claims
- 0743US2011154658A1Circuit substrate and manufacturing method thereofSUBTRON TECHNOLOGY CO LTD·Filed 2010·Application pending·0 cites
- 0836US2015136364A1Heat dissipation deviceCHUANG CHIH-HONG·Filed 2014·Application pending·0 cites
- 0935US2012088117A1Substrate structureCHUANG CHIH-HONG·Filed 2010·Application pending·0 cites
- 1030US2012181066A1Package carrierCHUANG CHIH-HONG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →