Inventor · disambiguated record
Derek S. Swanson
Also filed as: SWANSON DEREK S
2 granted patents·1 pending application·2 citations·filing 2013–2013
34Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0159US8754518B1Devices and methods for configuring conductive elements for a semiconductor packageCARPENTER BURTON J·Filed 2013·Granted Jun 17, 2014·2 cites·16 claims
- 0240US9070657B2Heat conductive substrate for integrated circuit packageFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Jun 30, 2015·0 cites·19 claims
- 0336US2015069624A1Recessed semiconductor die stackFREESCALE SEMICONDUCTOR INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →