Inventor · disambiguated record
Alexander Herbrandt
Also filed as: HERBRANDT ALEXANDER
11 granted patents·4 pending applications·36 citations·filing 2012–2025
85Inventor score
Top patents by PatentIndex Score
15 records- 0193US9275926B2Power module with cooling structure on bonding substrate for cooling an attached semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 1, 2016·22 cites·15 claims
- 0287US11533824B2Power semiconductor module and a method for producing a power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 20, 2022·2 cites·13 claims
- 0379US10693248B2Method for electrically connecting an electronic module and electronic assemblyINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jun 23, 2020·3 cites·21 claims
- 0477US9731370B2Directly cooled substrates for semiconductor modules and corresponding manufacturing methodsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 15, 2017·4 cites·8 claims
- 0573US11114780B2Electronic module with an electrically conductive press-fit terminal having a press-fit sectionINFINEON TECHNOLOGIES AG·Filed 2020·Granted Sep 7, 2021·1 cites·26 claims
- 0666US9585241B2Substrate, chip arrangement, and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 28, 2017·2 cites·17 claims
- 0764US12041755B2Power semiconductor module arrangement and method for producing a power semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 0856US12494440B2Power semiconductor module and method of increasing pin alignment accuracy for power semiconductor modulesINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 9, 2025·0 cites·21 claims
- 0955US2024266765A1Press-fit pin configurations for power semiconductor modulesINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1054US8872332B2Power module with directly attached thermally conductive structuresUHLEMANN ANDRE·Filed 2012·Granted Oct 28, 2014·2 cites·12 claims
- 1150US11756923B2High density and durable semiconductor device interconnectINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 1249US11856718B2Housing for a power semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 26, 2023·0 cites·14 claims
- 1349US2024039189A1Press-Fit Connector and ReceptacleINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1447US2017304922A1Directly Cooled Substrates for Semiconductor ModulesINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 1539US2025253220A1Power semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →