Inventor · disambiguated record
Venmathy Mcmahan
Also filed as: MCMAHAN VENMATHY
3 granted patents·1 pending application·14 citations·filing 2015–2017
62Inventor score
Files withINTEL CORP4
Top patents by PatentIndex Score
4 records- 0191US9685413B1Semiconductor package having an EMI shielding layerINTEL CORP·Filed 2016·Granted Jun 20, 2017·12 cites·16 claims
- 0274US9991211B2Semiconductor package having an EMI shielding layerINTEL CORP·Filed 2017·Granted Jun 5, 2018·2 cites·14 claims
- 0335US2018286704A1Processes and methods for applying underfill to singulated dieINTEL CORP·Filed 2017·Application pending·0 cites
- 0433US10475715B2Two material high K thermal encapsulant systemINTEL CORP·Filed 2015·Granted Nov 12, 2019·0 cites·11 claims
Join the waitlist — get patent alerts
Get an alert when Venmathy Mcmahan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →