Inventor · disambiguated record

Eng Hooi Yap

Also filed as: YAP ENG HOOI

3 granted patents·2 citations·filing 2003–2007

53Inventor score

Technology areasH10W

Files withINTEL CORP3

Top patents by PatentIndex Score

3 records

0158US7789285B2Solder printing process to reduce void formation in a microviaINTEL CORP·Filed 2007·Granted Sep 7, 2010·2 cites·10 claims
0236US7331503B2Solder printing process to reduce void formation in a microviaINTEL CORP·Filed 2004·Granted Feb 19, 2008·0 cites·6 claims
0330US7400040B2Thermal interface apparatus, systems, and methodsINTEL CORP·Filed 2003·Granted Jul 15, 2008·0 cites·24 claims

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