Inventor · disambiguated record
Steven Dean
Also filed as: DEAN STEVEN · DEAN STEVEN J
38 granted patents·7 pending applications·326 citations·filing 1989–2025
97Inventor score
Files withHEWLETT PACKARD ENTPR DEV LP29SILICON GRAPHICS INC5SILICON GRAPHICS INT CORP5CRAY RES INC3CRAY RESEARCH INC1
Top patents by PatentIndex Score
45 records- 0198US11157050B1Compute node tray coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2020·Granted Oct 26, 2021·16 cites·20 claims
- 0295US10813253B2Chassis coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2017·Granted Oct 20, 2020·13 cites·13 claims
- 0392US10955883B1Power supply dry disconnect liquid coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Mar 23, 2021·9 cites·28 claims
- 0492US10881030B1Electrical and liquid cooling midplaneHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Dec 29, 2020·14 cites·20 claims
- 0592US10188016B2Node blind mate liquid coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2016·Granted Jan 22, 2019·12 cites·20 claims
- 0692US9606588B2Closed-loop cooling system for high-density clustered computer systemSILLICON GRAPHICS INT CORP·Filed 2013·Granted Mar 28, 2017·26 cites·18 claims
- 0790US6483024B1Panel gasketSILICON GRAPHICS INC·Filed 2000·Granted Nov 19, 2002·57 cites·22 claims
- 0888US6672878B2Actuatable connector systemSILICON GRAPHICS INC·Filed 2002·Granted Jan 6, 2004·48 cites·26 claims
- 0987US11323787B1Multi-chip photonic node for scalable all-to-all connected fabricsHEWLETT PACKARD ENTPR DEV LP·Filed 2020·Granted May 3, 2022·2 cites·17 claims
- 1087US9128682B2Independent removable computer rack power distribution system for high-density clustered computer systemSILICON GRAPHICS INT CORP·Filed 2013·Granted Sep 8, 2015·11 cites·20 claims
- 1185US10893630B2Pumps with pre-charged fluidHEWLETT PACKARD ENTPR DEV LP·Filed 2018·Granted Jan 12, 2021·2 cites·17 claims
- 1284US12324127B2Folded-fin vapor chamber cold plateHEWLETT PACKARD ENTPR DEV LP·Filed 2022·Granted Jun 3, 2025·1 cites·20 claims
- 1384US11579668B2Multipoint contact conduction cooling of a removable deviceHEWLETT PACKARD ENTPR DEV LP·Filed 2020·Granted Feb 14, 2023·2 cites·20 claims
- 1483US10237999B2Configurable node expansion spaceHEWLETT PACKARD ENTPR DEV LP·Filed 2016·Granted Mar 19, 2019·5 cites·20 claims
- 1582US9229497B2On-blade cold sink for high-density clustered computer systemSILICON GRAPHICS INT CORP·Filed 2013·Granted Jan 5, 2016·4 cites·6 claims
- 1682US5131859AQuick disconnect system for circuit board modulesCRAY RESEARCH INC·Filed 1991·Granted Jul 21, 1992·52 cites·18 claims
- 1781US12504027B2Axial pump with adjustable impellerHEWLETT PACKARD ENTPR DEV LP·Filed 2024·Granted Dec 23, 2025·0 cites·17 claims
- 1881US10763191B1Dual in-line memory module (DIMM) Edgewater Spring (EWS) multi point contact cooling jacketHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Sep 1, 2020·3 cites·20 claims
- 1980US7466561B2System for insertion and extraction of an electronic moduleSILICON GRAPHICS INC·Filed 2005·Granted Dec 16, 2008·11 cites·20 claims
- 2079US2024329342A1Corrugated thermal interface device with lateral spring fingersHEWLETT PACKARD ENTPR DEV LP·Filed 2024·Application pending·0 cites
- 2176US2024397667A1Elastomer embedded multipoint contact coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2024·Application pending·0 cites
- 2274US12104618B2Axial pump with adjustable impellerHEWLETT PACKARD ENTPR DEV LP·Filed 2022·Granted Oct 1, 2024·0 cites·21 claims
- 2374US12038618B2Corrugated thermal interface device with lateral spring fingersHEWLETT PACKARD ENTPR DEV LP·Filed 2022·Granted Jul 16, 2024·0 cites·19 claims
- 2474US2025159840A1Accumulator for a chassis-level cooling systemHEWLETT PACKARD ENTPR DEV LP·Filed 2025·Application pending·0 cites
- 2572US12408303B2Elastomer embedded multipoint contact coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2022·Granted Sep 2, 2025·0 cites·15 claims
- 2670US2023262928A1Accumulator for a chassis-level cooling systemHEWLETT PACKARD ENTPR DEV LP·Filed 2022·Application pending·0 cites
- 2767US12443255B2Scheduling jobs for processor-based nodes to regulate coolant flow temperaturesHEWLETT PACKARD ENTPR DEV LP·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 2866US9811127B2Twin server blades for high-density clustered computer systemSILICON GRAPHICS INT CORP·Filed 2013·Granted Nov 7, 2017·1 cites·18 claims
- 2962USD314948SComputer cabinetCRAY RES INC·Filed 1989·Granted Feb 26, 1991·9 cites·1 claims
- 3061US11740674B2Systems and methods for reducing stranded power capacityHEWLETT PACKARD ENTPR DEV LP·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 3159US12439564B2Lever actuated cold plateHEWLETT PACKARD ENTPR DEV LP·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 3257US2025338437A1O-ring gland fittings for liquid cooling with o-ring compression seal having redundant non-radial seal pairsHEWLETT PACKARD ENTPR DEV LP·Filed 2024·Application pending·0 cites
- 3356US11307627B2Systems and methods for reducing stranded power capacityHEWLETT PACKARD ENTPR DEV LP·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
- 3456USD342485SComputer cabinetCRAY RES INC·Filed 1991·Granted Dec 21, 1993·10 cites·1 claims
- 3555US12044201B1Energy storage and electricity generating system and method of useDEAN DAVID·Filed 2023·Granted Jul 23, 2024·0 cites·6 claims
- 3655USD463796SIndustrial rackSILICON GRAPHICS INC·Filed 2001·Granted Oct 1, 2002·9 cites·1 claims
- 3754US10521260B2Workload management system and processHEWLETT PACKARD ENTPR DEV LP·Filed 2017·Granted Dec 31, 2019·0 cites·9 claims
- 3854US9477592B2Localized fast bulk storage in a multi-node computer systemSILICON GRAPHICS INT CORP·Filed 2013·Granted Oct 25, 2016·0 cites·19 claims
- 3949USD332779SComputer cabinetCRAY RES INC·Filed 1991·Granted Jan 26, 1993·6 cites·1 claims
- 4048US10941892B2Valved connectorHEWLETT PACKARD ENTPR DEV LP·Filed 2017·Granted Mar 9, 2021·0 cites·20 claims
- 4147US9268684B2Populating localized fast bulk storage in a multi-node computer systemSILICON GRAPHICS INT CORP·Filed 2013·Granted Feb 23, 2016·0 cites·23 claims
- 4245US11406036B2Flexible I/O server interface card orientationHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Aug 2, 2022·0 cites·20 claims
- 4344US2022344239A1Cooling assembly and an electronic circuit module having the sameHEWLETT PACKARD ENTPR DEV LP·Filed 2021·Application pending·0 cites
- 4441US2022173825A1Optical network on chip for processor communicationHEWLETT PACKARD ENTPR DEV LP·Filed 2020·Application pending·0 cites
- 4535USD464973SPanelSILICON GRAPHICS INC·Filed 2001·Granted Oct 29, 2002·3 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →