Inventor · disambiguated record
Jay A. Curless
Also filed as: CURLESS JAY A
5 granted patents·7 pending applications·103 citations·filing 1999–2004
81Inventor score
Top patents by PatentIndex Score
12 records- 0186US6241821B1Method for fabricating a semiconductor structure having a crystalline alkaline earth metal oxide interface with siliconMOTOROLA INC·Filed 1999·Granted Jun 5, 2001·45 cites·22 claims
- 0285US6224669B1Method for fabricating a semiconductor structure having a crystalline alkaline earth metal oxide interface with siliconMOTOROLA INC·Filed 2000·Granted May 1, 2001·35 cites·36 claims
- 0369US6589856B2Method and apparatus for controlling anti-phase domains in semiconductor structures and devicesMOTOROLA INC·Filed 2001·Granted Jul 8, 2003·15 cites·8 claims
- 0459US7141857B2Semiconductor structures and methods of fabricating semiconductor structures comprising hafnium oxide modified with lanthanum, a lanthanide-series metal, or a combination thereofFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Nov 28, 2006·8 cites·11 claims
- 0542US2001023660A1Method for fabricating a semiconductor structure having a crystalline alkaline earth metal oxide interface with siliconMOTOROLA INC·Filed 2001·Application pending·0 cites
- 0636US2003024471A1Fabrication of semiconductor structures and devices forms by utilizing laser assisted depositionMOTOROLA INC·Filed 2001·Application pending·0 cites
- 0735US6852588B1Methods of fabricating semiconductor structures comprising epitaxial Hf3Si2 layersFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Feb 8, 2005·0 cites·43 claims
- 0835US2003015760A1Structure and process for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate for materials used to form the same including a combined anneal of CMOS and compound semiconductor regionsMOTOROLA INC·Filed 2001·Application pending·0 cites
- 0935US2003017626A1Method and apparatus for controlling propagation of dislocations in semiconductor structures and devicesMOTOROLA INC·Filed 2001·Application pending·0 cites
- 1035US2003015731A1Process for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate used to form the same and in-situ annealingMOTOROLA INC·Filed 2001·Application pending·0 cites
- 1134US2003017720A1Method for fabricating semiconductor structures utilizing atomic layer epitaxy of organometallic compounds to deposit a metallic surfactant layerMOTOROLA INC·Filed 2001·Application pending·0 cites
- 1233US2003015704A1Structure and process for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate for materials used to form the same including intermediate surface cleaningMOTOROLA INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →