Inventor · disambiguated record
Tetsuya Miyazawa
Also filed as: MIYAZAWA TETSUYA
5 granted patents·1 pending application·9 citations·filing 2004–2018
69Inventor score
Top patents by PatentIndex Score
6 records- 0177US10453924B2Silicon carbide semiconductor substrate, method of manufacturing silicon carbide semiconductor substrate, semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Oct 22, 2019·2 cites·4 claims
- 0269US10354867B2Epitaxial wafer manufacturing method, epitaxial wafer, semiconductor device manufacturing method, and semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Jul 16, 2019·1 cites·18 claims
- 0367US7046148B2Distribution management systemFUJITSU LTD·Filed 2004·Granted May 16, 2006·6 cites·5 claims
- 0448US10748763B2Silicon carbide semiconductor substrate, method of manufacturing a silicon carbide semiconductor device, and silicon carbide semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Aug 18, 2020·0 cites·17 claims
- 0546US9496345B2Semiconductor structure, semiconductor device, and method for producing semiconductor structureNAT INST ADVANCED IND SCIENCE & TECH·Filed 2013·Granted Nov 15, 2016·0 cites·11 claims
- 0641US2007267008A1Method of Hydrolyzing an Organic CompoundTAMA TLO CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →