Inventor · disambiguated record
Francis J. Carney
Also filed as: CARNEY FRANCIS · CARNEY FRANCIS J · CARNEY JR FRANCIS J
121 granted patents·26 pending applications·1,307 citations·filing 1989–2025
99Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC99SEMICONDUCTOR COMPONENTS IND25MOTOROLA INC16SEDDON MICHAEL J5CARNEY FRANCIS J1
Top patents by PatentIndex Score
147 records- 0196US10090233B2Semiconductor device and method of forming micro interconnect structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Oct 2, 2018·8 cites·18 claims
- 0296US9564409B2Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickelSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Feb 7, 2017·11 cites·17 claims
- 0395US12020972B2Curved semiconductor die systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jun 25, 2024·3 cites·19 claims
- 0495US5773359AInterconnect system and method of fabricationMOTOROLA INC·Filed 1995·Granted Jun 30, 1998·219 cites·11 claims
- 0594US10014245B2Method for removing material from a substrate using in-situ thickness measurementSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jul 3, 2018·5 cites·20 claims
- 0694US9679878B1Embedded stacked die packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jun 13, 2017·9 cites·23 claims
- 0794US5480835AElectrical interconnect and method for forming the sameMOTOROLA INC·Filed 1994·Granted Jan 2, 1996·107 cites·20 claims
- 0892US9852972B2Semiconductor device and method of aligning semiconductor wafers for bondingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Dec 26, 2017·4 cites·18 claims
- 0992US5895229AMicroelectronic package including a polymer encapsulated die, and method for forming sameMOTOROLA INC·Filed 1997·Granted Apr 20, 1999·128 cites·11 claims
- 1091US12469709B2Semiconductor package electrical contact structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Nov 11, 2025·1 cites·20 claims
- 1191US9847310B2Flip chip bonding alloysSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Dec 19, 2017·8 cites·18 claims
- 1291US6093972AMicroelectronic package including a polymer encapsulated dieMOTOROLA INC·Filed 1999·Granted Jul 25, 2000·125 cites·5 claims
- 1391US2025349550A1Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1491US2025349549A1Semiconductor devices having die support structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1590US9691732B2Semiconductor package with elastic coupler and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jun 27, 2017·6 cites·13 claims
- 1690USD489338SPackaged semiconductor deviceSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted May 4, 2004·43 cites·1 claims
- 1789US11437291B2Multichip module supports and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Sep 6, 2022·2 cites·15 claims
- 1889US11404276B2Semiconductor packages with thin die and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 2, 2022·2 cites·6 claims
- 1989US10199316B2Semiconductor device and method of aligning semiconductor wafers for bondingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Feb 5, 2019·2 cites·24 claims
- 2088US12374555B2Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 2188US11710691B2Semiconductor device and method of forming micro interconnect structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jul 25, 2023·1 cites·16 claims
- 2288US10319652B2Semiconductor package with elastic coupler and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 11, 2019·5 cites·9 claims
- 2387US12230559B2Semiconductor device and method of forming micro interconnect structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 2487US7227240B2Semiconductor device with wire bond inductor and methodSEMICONDUCTOR COMPONENTS IND·Filed 2002·Granted Jun 5, 2007·57 cites·18 claims
- 2587US5933558AOptoelectronic device and method of assemblyMOTOROLA INC·Filed 1997·Granted Aug 3, 1999·90 cites·20 claims
- 2687US5467253ASemiconductor chip package and method of formingMOTOROLA INC·Filed 1994·Granted Nov 14, 1995·109 cites·21 claims
- 2786US12272572B2Non-planar semiconductor packaging systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 2886US12119294B2Through-substrate via structure and method of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 2985US12374554B2Semiconductor packages with die including cavities and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 3085US11342189B2Semiconductor packages with die including cavities and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 24, 2022·1 cites·20 claims
- 3185US10950534B2Through-substrate via structure and method of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 16, 2021·1 cites·20 claims
- 3285US9941257B2Embedded stacked die packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Apr 10, 2018·3 cites·20 claims
- 3385US7495323B2Semiconductor package structure having multiple heat dissipation paths and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Feb 24, 2009·14 cites·18 claims
- 3484US11646267B2Thinned semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 9, 2023·1 cites·19 claims
- 3584US10818587B2Semiconductor device and method of forming a curved image sensorSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Oct 27, 2020·1 cites·20 claims
- 3683US12199041B2Thinned semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 3783US12132005B2Supports for thinned semiconductor substrates and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 3883US8084335B2Method of thinning a semiconductor wafer using a film frameSEDDON MICHAEL J·Filed 2008·Granted Dec 27, 2011·8 cites·22 claims
- 3982US12476132B2Curved semiconductor die systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
- 4082US11257759B1Isolation in a semiconductor deviceSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Feb 22, 2022·1 cites·20 claims
- 4182US5883996AElectronic component for aligning a light transmitting structureMOTOROLA INC·Filed 1997·Granted Mar 16, 1999·59 cites·13 claims
- 4282US2025201753A1Semiconductor packages with an intermetallic layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 4381US12170239B2Direct bonded copper substrates fabricated using silver sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 4481US9385041B2Method for insulating singulated electronic dieSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Jul 5, 2016·4 cites·20 claims
- 4581US2025183217A1Semiconductor packages with an intermetallic layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 4681US2025022808A1Supports for thinned semiconductor substrates and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 4781US2025022813A1Multidie supports and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 4880US10079199B2Through-substrate via structure and method of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Sep 18, 2018·1 cites·15 claims
- 4980US2025149424A1Semiconductor device and method of forming micro interconnect structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 5080US2025118622A1Direct bonded copper substrates fabricated using silver sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
Showing the top 50 of 147 patent records by PatentIndex Score.
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