Inventor · disambiguated record
Fumihiko Momose
Also filed as: MOMOSE FUMIHIKO
16 granted patents·4 pending applications·13 citations·filing 2010–2024
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
20 records- 0179US10727194B2Solder material for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Jul 28, 2020·2 cites·11 claims
- 0275US10157877B2Semiconductor device and manufacturing method of semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Dec 18, 2018·3 cites·8 claims
- 0373US10297527B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted May 21, 2019·2 cites·9 claims
- 0470US8395262B2Semiconductor device and method for manufacturing the sameMOMOSE FUMIHIKO·Filed 2010·Granted Mar 12, 2013·4 cites·3 claims
- 0569US11145615B2Solder material for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted Oct 12, 2021·0 cites·10 claims
- 0666US2021407953A1Solder material for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Application pending·0 cites
- 0763US10090223B2Semiconductor device and method of manufacturing sameFUJI ELECTRIC CO LTD·Filed 2017·Granted Oct 2, 2018·1 cites·8 claims
- 0863US2025041977A1Solder materialFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 0959US10896892B2Wire bonding apparatusFUJI ELECTRIC CO LTD·Filed 2015·Granted Jan 19, 2021·1 cites·11 claims
- 1057US12494451B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·4 claims
- 1152US2023307346A1Semiconductor device and method of manufacturing the sameFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 1249US8860220B2Semiconductor device and method for manufacturing the sameFUJI ELECTRIC CO LTD·Filed 2013·Granted Oct 14, 2014·0 cites·2 claims
- 1345US2022375845A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 1442US10090222B2Semiconductor device with heat dissipation and method of making sameFUJI ELECTRIC CO LTD·Filed 2018·Granted Oct 2, 2018·0 cites·8 claims
- 1541US10199305B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Feb 5, 2019·0 cites·5 claims
- 1640US9748186B2Semiconductor device and method for manufacturing the semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Aug 29, 2017·0 cites·18 claims
- 1738US10497586B2Semiconductor device and a method of manufacturing the sameFUJI ELECTRIC CO LTD·Filed 2017·Granted Dec 3, 2019·0 cites·11 claims
- 1837US10276474B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Apr 30, 2019·0 cites·11 claims
- 1935US11749581B2Semiconductor module and method for manufacturing sameFUJI ELECTRIC CO LTD·Filed 2019·Granted Sep 5, 2023·0 cites·13 claims
- 2034US9978701B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted May 22, 2018·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →