Inventor · disambiguated record
Shinji Tada
Also filed as: TADA SHINJI
14 granted patents·2 pending applications·223 citations·filing 1998–2023
91Inventor score
Top patents by PatentIndex Score
16 records- 0191US9504154B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Nov 22, 2016·12 cites·8 claims
- 0291US6179935B1Solder alloysFUJI ELECTRIC CO LTD·Filed 1998·Granted Jan 30, 2001·89 cites·2 claims
- 0390US6365097B1Solder alloyFUJI ELECTRIC CO LTD·Filed 2000·Granted Apr 2, 2002·52 cites·8 claims
- 0485US6156132ASolder alloysFUJI ELECTRIC CO LTD·Filed 1999·Granted Dec 5, 2000·55 cites·6 claims
- 0575US10157877B2Semiconductor device and manufacturing method of semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Dec 18, 2018·3 cites·8 claims
- 0673US8196300B2Manufacturing method of electric contact and manufacturing equipment of electric contactIMAMURA SEIJI·Filed 2009·Granted Jun 12, 2012·5 cites·20 claims
- 0772US9786587B2Semiconductor device and method for manufacturing the semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Oct 10, 2017·2 cites·20 claims
- 0860US9406603B2Semiconductor device and method for manufacturing the semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Aug 2, 2016·1 cites·11 claims
- 0959US2024222236A1Electronic device and manufacturing method thereofFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 1056US12476196B2Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·13 claims
- 1155US11664342B2Semiconductor device with a laser-connected terminalFUJI ELECTRIC CO LTD·Filed 2021·Granted May 30, 2023·0 cites·12 claims
- 1253US2023187323A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 1350US9579746B2Thermocompression bonding structure and thermocompression bonding methodFUJI ELECTRIC CO LTD·Filed 2014·Granted Feb 28, 2017·0 cites·4 claims
- 1447US6425173B1Method of handling a forming die between die forming operationsNGK INSULATORS LTD·Filed 2000·Granted Jul 30, 2002·2 cites·1 claims
- 1542US10446460B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Oct 15, 2019·0 cites·16 claims
- 1632US6135752AForming die and managing method thereofNGK INSULATORS LTD·Filed 1998·Granted Oct 24, 2000·2 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →