Inventor · disambiguated record
In Gyun Jeon
Also filed as: JEON IN G · JEON IN GYUN
28 granted patents·5 pending applications·189 citations·filing 2003–2019
95Inventor score
Files withDONGBU ELECTRONICS CO LTD17JEON IN GYUN4OPTOLANE TECH INC4SILICONFILE TECHNOLOGIES INC3DONGBUANAM SEMICONDUCTOR INC2
Top patents by PatentIndex Score
33 records- 0196US7973342B2CMOS image sensor and method for manufacturing the sameDONGBU ELECTRONICS CO LTD·Filed 2009·Granted Jul 5, 2011·34 cites·20 claims
- 0295US7354841B2Method for fabricating photodiode of CMOS image sensorDONGBU ELECTRONICS CO LTD·Filed 2005·Granted Apr 8, 2008·33 cites·9 claims
- 0390US10018562B2Biochip including side emitting-type light-emitting device and fabrication method thereofOPTOLANE TECH INC·Filed 2015·Granted Jul 10, 2018·4 cites·6 claims
- 0488US8421134B2Back side illumination image sensor reduced in size and method for manufacturing the sameJEON IN GYUN·Filed 2010·Granted Apr 16, 2013·7 cites·3 claims
- 0584US8906781B2Method for electrically connecting wafers using butting contact structure and semiconductor device fabricated through the sameSILICONFILE TECHNOLOGIES INC·Filed 2013·Granted Dec 9, 2014·7 cites·9 claims
- 0684US7229878B2Phototransistor of CMOS image sensor and method for fabricating the sameDONGBU ELECTRONICS CO LTD·Filed 2005·Granted Jun 12, 2007·8 cites·16 claims
- 0783US7612318B2Complementary metal oxide semiconductor image sensor having cross talk prevention and method for fabricating the sameDONGBU ELECTRONICS CO LTD·Filed 2004·Granted Nov 3, 2009·34 cites·7 claims
- 0880US6982186B2CMOS image sensor and method for manufacturing the sameDONGBUANAM SEMICONDUCTOR INC·Filed 2003·Granted Jan 3, 2006·27 cites·14 claims
- 0977US7678643B2Method for manufacturing a CMOS image sensorDONGBU ELECTRONICS CO LTD·Filed 2006·Granted Mar 16, 2010·4 cites·10 claims
- 1076US7651903B2CMOS image sensor and method for manufacturing the sameDONGBU ELECTRONICS CO LTD·Filed 2006·Granted Jan 26, 2010·7 cites·16 claims
- 1174US8420429B2Back side illumination image sensor reduced in size and method for manufacturing the sameJEON IN GYUN·Filed 2012·Granted Apr 16, 2013·1 cites·5 claims
- 1274US7078260B2CMOS image sensors and methods for fabricating the sameDONGBU ELECTRONICS CO LTD·Filed 2004·Granted Jul 18, 2006·15 cites·14 claims
- 1372US7612395B2CMOS image sensorsDONGBU ELECTRONICS CO LTD·Filed 2006·Granted Nov 3, 2009·2 cites·20 claims
- 1471US10279352B2PCR module, PCR system having the same, and method of inspecting using the sameOPTOLANE TECH INC·Filed 2016·Granted May 7, 2019·1 cites·16 claims
- 1570US7507597B2Method for fabricating CMOS image sensorDONGBU ELECTRONICS CO LTD·Filed 2006·Granted Mar 24, 2009·2 cites·18 claims
- 1666US7687306B2CMOS image sensor and method for manufacturing the sameDONGBU ELECTRONICS CO LTD·Filed 2006·Granted Mar 30, 2010·1 cites·10 claims
- 1764US10591415B2Biochip including side emitting-type light-emitting device and fabrication method thereofOPTOLANE TECH INC·Filed 2018·Granted Mar 17, 2020·0 cites·7 claims
- 1863US8816459B2Image sensor having wave guide and method for manufacturing the sameJEON IN-GYUN·Filed 2012·Granted Aug 26, 2014·0 cites·9 claims
- 1962US8399282B2Method for forming pad in wafer with three-dimensional stacking structureAHN HEUI GYUN·Filed 2011·Granted Mar 19, 2013·1 cites·16 claims
- 2060US10710084B2PCR module, PCR system having the same, and method of inspecting using the sameOPTOLANE TECH INC·Filed 2019·Granted Jul 14, 2020·0 cites·3 claims
- 2157US8368158B2Image sensor having wave guide and method for manufacturing the sameSILICONFILE TECHNOLOGIES INC·Filed 2010·Granted Feb 5, 2013·0 cites·17 claims
- 2256US7510896B2CMOS image sensor and method for manufacturing the sameDONGBU ELECTRONICS CO LTD·Filed 2006·Granted Mar 31, 2009·0 cites·9 claims
- 2351US8993411B2Method for forming pad in wafer with three-dimensional stacking structureSILICONFILE TECHNOLOGIES INC·Filed 2013·Granted Mar 31, 2015·0 cites·14 claims
- 2449US7491991B2Method for fabricating CMOS image sensorDONGBU ELECTRONICS CO LTD·Filed 2006·Granted Feb 17, 2009·0 cites·20 claims
- 2548US7541210B2Method for fabricating CMOS image sensorDONGBU ELECTRONICS CO LTD·Filed 2005·Granted Jun 2, 2009·0 cites·10 claims
- 2648US2007069259A1CMOS image sensor and method of manufacturing the sameDONGBU ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2748US2007099371A1CMOS image sensor and manufacturing method thereofJEON IN G·Filed 2006·Application pending·0 cites
- 2847US7432125B2CMOS image sensor and manufacturing method thereofDONGBU ELECTRONICS CO LTD·Filed 2004·Granted Oct 7, 2008·1 cites·4 claims
- 2946US2007096233A1Cmos image sensorJEON IN GYUN·Filed 2006·Application pending·0 cites
- 3046US2006001062A1Method for fabricating CMOS image sensorDONGBUANAM SEMICONDUCTOR INC·Filed 2005·Application pending·0 cites
- 3140US7223953B2Image sensor and method of manufacturing the sameDONGBU ELECTRONICS CO LTD·Filed 2003·Granted May 29, 2007·0 cites·9 claims
- 3232US6897500B2CMOS image sensorDONGBU ELECTRONICS CO LTD·Filed 2003·Granted May 24, 2005·0 cites·4 claims
- 3329US2004070043A1CMOS image sensorsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →