Inventor · disambiguated record
Chan-Suk Lee
Also filed as: LEE CHAN SUK
4 granted patents·2 pending applications·41 citations·filing 2004–2020
72Inventor score
Top patents by PatentIndex Score
6 records- 0177US7485959B2Structure for joining a semiconductor package to a substrate using a solder columnSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 3, 2009·2 cites·14 claims
- 0272US7199458B2Stacked offset semiconductor package and method for fabricatingSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 3, 2007·25 cites·20 claims
- 0363US6984877B2Bumped chip carrier package using lead frame and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 10, 2006·14 cites·11 claims
- 0443US2022002032A1Water container for campingLEE CHAN SUK·Filed 2020·Application pending·0 cites
- 0540US7414303B2Lead on chip semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 19, 2008·0 cites·19 claims
- 0635US2012049386A1Semiconductor packageOH HYUNG-GEUN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →