Inventor · disambiguated record
Takenao Nemoto
Also filed as: NEMOTO TAKENAO
6 granted patents·10 pending applications·33 citations·filing 1993–2024
76Inventor score
Top patents by PatentIndex Score
16 records- 0178US6992011B2Method and apparatus for removing material from chamber and wafer surfaces by high temperature hydrogen-containing plasmaTOKYO ELECTRON LTD·Filed 2003·Granted Jan 31, 2006·25 cites·23 claims
- 0274US9165771B2Pulsed gas plasma doping method and apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Oct 20, 2015·3 cites·20 claims
- 0366US2025196283A1Systems and methods for panel polishingTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0464US10553410B2Method of processing workpieceTOKYO ELECTRON LTD·Filed 2016·Granted Feb 4, 2020·1 cites·11 claims
- 0557US2015110973A1Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 0647US2009108452A1Semiconductor device and method for manufacturing the sameTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 0746US2010240283A1Method of Chemical Mechanical PolishingARACA INC·Filed 2009·Application pending·0 cites
- 0845US9543191B2Wiring structure having interlayer insulating film and wiring line without a barrier layer betweenTOKYO ELECTRON LTD·Filed 2013·Granted Jan 10, 2017·0 cites·3 claims
- 0944US2010159804A1Method of observing pattern evolution using variance and fourier transform spectra of friction forces in cmpARACA INC·Filed 2008·Application pending·0 cites
- 1043US2015255258A1Plasma processing apparatus and substrate processing apparatus provided with sameTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 1141US2015132929A1Method for injecting dopant into substrate to be processed, and plasma doping apparatusTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 1238US2014225263A1Semiconductor device and method for manufacturing semiconductor deviceNEMOTO TAKENAO·Filed 2012·Application pending·0 cites
- 1336US2012125376A1Wet processing apparatus and wet processing methodOHMI TADAHIRO·Filed 2010·Application pending·0 cites
- 1432US2013130513A1Interlayer insulating layer forming method and semiconductor deviceMIYATANI KOTARO·Filed 2011·Application pending·0 cites
- 1531US9765430B2Plasma processing apparatus and film formation methodTOKYO ELECTRON LTD·Filed 2015·Granted Sep 19, 2017·0 cites·11 claims
- 1629US5565380ASemiconductor device and process for production thereofKAWASAKI STEEL CO·Filed 1993·Granted Oct 15, 1996·4 cites·10 claims
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