Inventor · disambiguated record
Raymundo M. Camenforte
Also filed as: CAMENFORTE RAYMUNDO · CAMENFORTE RAYMUNDO M · CAMENFORTE RAYMUNDO MONASTERIO
20 granted patents·5 pending applications·340 citations·filing 1998–2024
95Inventor score
Files withAPPLE INC10ST ASSEMBLY TEST SERVICES PTE4ST ASSEMBLY TEST SERVICES LTD3ST ASSEMBLY TEST SERVICE LTD2TEXAS INSTRUMENTS INC2
Top patents by PatentIndex Score
25 records- 0197US11862557B2Selectable monolithic or external scalable die-to-die interconnection system methodologyAPPLE INC·Filed 2021·Granted Jan 2, 2024·4 cites·11 claims
- 0297US11728266B2Die stitching and harvesting of arrayed structuresAPPLE INC·Filed 2020·Granted Aug 15, 2023·6 cites·14 claims
- 0395US12087689B2Selectable monolithic or external scalable die-to-die interconnection system methodologyAPPLE INC·Filed 2023·Granted Sep 10, 2024·2 cites·16 claims
- 0493US6537848B2Super thin/super thermal ball grid array packageST ASSEMBLY TEST SERVICES LTD·Filed 2001·Granted Mar 25, 2003·79 cites·13 claims
- 0592US7521284B2System and method for increased stand-off height in stud bumping processTEXAS INSTRUMENTS INC·Filed 2007·Granted Apr 21, 2009·70 cites·5 claims
- 0689US8575758B2Laser-assisted cleaving of a reconstituted wafer for stacked die assembliesWEST JEFFREY ALAN·Filed 2011·Granted Nov 5, 2013·10 cites·9 claims
- 0787US6544812B1Single unit automated assembly of flex enhanced ball grid array packagesST ASSEMBLY TEST SERVICE LTD·Filed 2000·Granted Apr 8, 2003·45 cites·12 claims
- 0885US12074077B2Flexible package architecture concept in fanoutAPPLE INC·Filed 2020·Granted Aug 27, 2024·2 cites·12 claims
- 0985US11395408B2Wafer-level passive array packagingAPPLE INC·Filed 2020·Granted Jul 19, 2022·2 cites·13 claims
- 1079US2025029921A1Selectable Monolithic or External Scalable Die-to-Die Interconnection System MethodologyAPPLE INC·Filed 2024·Application pending·0 cites
- 1173US2025183127A1Molded Silicon on Passive PackageAPPLE INC·Filed 2024·Application pending·0 cites
- 1270US6744125B2Super thin/super thermal ball grid array packageST ASSEMBLY TEST SERVICES PTE LTD·Filed 2003·Granted Jun 1, 2004·18 cites·2 claims
- 1370US6355199B1Method of molding flexible circuit with molded stiffenerST ASSEMBLY TEST SERVICES PTE·Filed 1999·Granted Mar 12, 2002·35 cites·17 claims
- 1469US6535004B2Testing of BGA and other CSP packages using probing techniquesST ASSEMBLY TEST SERVICE LTD·Filed 2002·Granted Mar 18, 2003·12 cites·14 claims
- 1567US12165956B2Molded silicon on passive packageAPPLE INC·Filed 2021·Granted Dec 10, 2024·0 cites·15 claims
- 1662US8815642B2Laser-assisted cleaving of a reconstituted wafer for stacked die assembliesTEXAS INSTRUMENTS INC·Filed 2013·Granted Aug 26, 2014·1 cites·11 claims
- 1761US6791346B2Testing of BGA and other CSP packages using probing techniquesST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Sep 14, 2004·8 cites·28 claims
- 1861US2025329673A1Direct Wire Reveal PackageAPPLE INC·Filed 2024·Application pending·0 cites
- 1961US2025300120A1Wafer Level Land Grid ArrayAPPLE INC·Filed 2024·Application pending·0 cites
- 2060US6759752B2Single unit automated assembly of flex enhanced ball grid array packagesST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Jul 6, 2004·8 cites·12 claims
- 2158US6404212B1Testing of BGA and other CSP packages using probing techniquesST ASSEMBLY TEST SERVICES PTE·Filed 1999·Granted Jun 11, 2002·17 cites·14 claims
- 2257US6617525B2Molded stiffener for flexible circuit moldingST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Sep 9, 2003·6 cites·6 claims
- 2346US6103550AMolded tape support for a molded circuit package prior to dicingST ASSEMBLY TEST SERVICES PTE·Filed 1998·Granted Aug 15, 2000·13 cites·18 claims
- 2441US6621151B1Lead frame for an integrated circuit chipINST OF MICROELECTRONICS·Filed 2000·Granted Sep 16, 2003·2 cites·15 claims
- 2534US2011193200A1Semiconductor wafer chip scale package test flow and dicing processLYNE KEVIN P·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →