Inventor · disambiguated record
Bun Chay Te
Also filed as: TE BUN C · TE BUN CHAY
6 granted patents·2 pending applications·46 citations·filing 2000–2014
79Inventor score
Top patents by PatentIndex Score
8 records- 0182US6586112B1Mandrel and orifice plates electroformed using the sameHEWLETT PACKARD CO·Filed 2000·Granted Jul 1, 2003·28 cites·8 claims
- 0279US7346915B2Compact and portable optical disc driveHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Mar 18, 2008·4 cites·30 claims
- 0366US9895847B2Method and apparatus for fabricating three dimensional modelsSOLIDSCAPE INC·Filed 2014·Granted Feb 20, 2018·1 cites·21 claims
- 0457US6315385B1Self-locating orifice plate construction for thermal ink jet printheadsHEWLETT PACKARD CO·Filed 2000·Granted Nov 13, 2001·8 cites·9 claims
- 0549US6854829B2Laser-actuatable inkjet printing system and printerHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Feb 15, 2005·5 cites·8 claims
- 0647US2008080083A1Methods and systems for a reader/writer selectively positionable inside and outside a chassisHOMER STEVEN S·Filed 2006·Application pending·0 cites
- 0741US9427773B2Method for simultaneously scribing and filling of scribed channel, trough, trench or grooveSOLIDSCAPE INC·Filed 2014·Granted Aug 30, 2016·0 cites·16 claims
- 0834US2005264600A1Emission of fluid droplet from printhead with coherent irradiationHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →