Inventor · disambiguated record
Sanguk Han
Also filed as: HAN SANGUK
9 granted patents·5 pending applications·8 citations·filing 2020–2024
79Inventor score
Files withSAMSUNG ELECTRONICS CO LTD14
Top patents by PatentIndex Score
14 records- 0195US11444060B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 13, 2022·4 cites·20 claims
- 0293US11923342B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 5, 2024·2 cites·19 claims
- 0389US11574873B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 7, 2023·2 cites·17 claims
- 0478US2024404955A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0576US12087696B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·19 claims
- 0666US11869818B2Chip-stacked semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·12 claims
- 0762US11328966B2Chip-stacked semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
- 0859US2024395747A1Semiconductor package and method of inspecting the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0958US11842945B2Chip on film package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 12, 2023·0 cites·15 claims
- 1057US2024142493A1Socket for testing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1156US12148337B2Chip on film package with trench to reduce slippage and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 1256US2025014953A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1356US2024387421A1Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1453US12230576B2Chip-on-film package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →