Inventor · disambiguated record
Xianxian Yu
Also filed as: YU XIANXIAN
2 granted patents·1 pending application·0 citations·filing 2013–2013
22Inventor score
Technology areasH10P
Top patents by PatentIndex Score
3 records- 0140US9856572B2Additive for reducing voids after annealing of copper plating with through silicon viaSHANGHAI SINYANG SEMICONDUCTOR MAT CO LTD·Filed 2013·Granted Jan 2, 2018·0 cites·8 claims
- 0237US9915005B2Additive C capable of changing microvia-filling method by TSV copper plating, and electroplating solution containing sameSHANGHAI SINYANG SEMICONDUCTOR MAT CO LTD·Filed 2013·Granted Mar 13, 2018·0 cites·8 claims
- 0335US2016190007A1A method for microvia filling by copper electroplating with tsv technology for 3d copper interconnection at high aspect ratioSHANGHAI SINYANG SEMICONDUCTOR MAT CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →