Inventor · disambiguated record
Shinichi Ishiwata
Also filed as: ISHIWATA SHINICHI
14 granted patents·3 pending applications·285 citations·filing 1988–2012
93Inventor score
Files withFURUKAWA ELECTRIC CO LTD11MARUYAMA HIROMITSU2FURAKAWA ELECTRIC CO LTD1HITACHI CHEMICAL CO LTD1KITA KENJI1
Top patents by PatentIndex Score
17 records- 0188US7517724B2Dicing/die bonding sheetHITACHI CHEMICAL CO LTD·Filed 2005·Granted Apr 14, 2009·22 cites·15 claims
- 0283USD628170SSemiconductor wafer processing tapeFURUKAWA ELECTRIC CO LTD·Filed 2008·Granted Nov 30, 2010·33 cites·1 claims
- 0383USD621803SSemiconductor wafer processing tapeFURUKAWA ELECTRIC CO LTD·Filed 2008·Granted Aug 17, 2010·33 cites·1 claims
- 0478US4999242ARadiation-curable adhesive tapeFURUKAWA ELECTRIC CO LTD·Filed 1988·Granted Mar 12, 1991·51 cites·25 claims
- 0575US8545979B2Wafer-processing tape and method of producing the sameKITA KENJI·Filed 2006·Granted Oct 1, 2013·8 cites·5 claims
- 0674US8043698B2Method of producing a semiconductor device, and wafer-processing tapeFURUKAWA ELECTRIC CO LTD·Filed 2007·Granted Oct 25, 2011·9 cites·10 claims
- 0764US5281473ARadiation-curable adhesive tapeFURAKAWA ELECTRIC CO LTD·Filed 1992·Granted Jan 25, 1994·41 cites·22 claims
- 0857US5538771ASemiconductor wafer-securing adhesive tapeFURUKAWA ELECTRIC CO LTD·Filed 1993·Granted Jul 23, 1996·33 cites·10 claims
- 0956US9324592B2Wafer processing tapeMARUYAMA HIROMITSU·Filed 2008·Granted Apr 26, 2016·1 cites·7 claims
- 1056US7413965B2Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tapeFURUKAWA ELECTRIC CO LTD·Filed 2005·Granted Aug 19, 2008·2 cites·12 claims
- 1155US5149586ARadiation-curable adhesive tapeFURUKAWA ELECTRIC CO LTD·Filed 1990·Granted Sep 22, 1992·27 cites·10 claims
- 1254US5300172ASurface-protection method during etchingFURUKAWA ELECTRIC CO LTD·Filed 1992·Granted Apr 5, 1994·25 cites·9 claims
- 1347US8722184B2Wafer-adhering adhesive tapeMORISHIMA YASUMASA·Filed 2008·Granted May 13, 2014·0 cites·10 claims
- 1446US2005249909A1Wafer-adhering adhesive tapeFURUKAWA ELECTRIC CO LTD·Filed 2005·Application pending·0 cites
- 1544US2011014443A1Adhesive tape for electronic component fabricationFURUKAWA ELECTRIC CO LTD·Filed 2008·Application pending·0 cites
- 1642US9324593B2Wafer processing tapeMARUYAMA HIROMITSU·Filed 2012·Granted Apr 26, 2016·0 cites·10 claims
- 1742US2006204749A1Wafer-processing tapeFURUKAWA ELECTRIC CO LTD·Filed 2006·Application pending·0 cites
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