Inventor · disambiguated record
Duseop Yoon
Also filed as: YOON DUSEOP
6 granted patents·2 pending applications·2 citations·filing 2019–2024
69Inventor score
Files withSAMSUNG ELECTRONICS CO LTD8
Top patents by PatentIndex Score
8 records- 0189US11728270B2Semiconductor interconnect, electrode for semiconductor device, and method of preparing multielement compound thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·2 cites·29 claims
- 0274US12489058B2Wiring material for semiconductor device, wiring for semiconductor device including the same, and semiconductor device including the wiringSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 0371US12014985B2Semiconductor interconnect, electrode for semiconductor device, and method of preparing multielement compound thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·30 claims
- 0465US11830814B2Wiring material for semiconductor device, wiring for semiconductor device including the same, and semiconductor device including the wiringSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·28 claims
- 0557US2024222432A1Semiconductor device including two-dimensional (2d) materialSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0653US11114616B2Ti-based amorphous alloy and phase change memory device applying the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·14 claims
- 0753US2024021683A1Semiconductor device including two-dimensional material and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0843US11634793B2Quasicrystalline material and semiconductor device applying the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →