Inventor · disambiguated record
Mario Francisco Velez
Also filed as: VELEZ MARIO F · VELEZ MARIO FRANCISCO · Velez Mario
104 granted patents·32 pending applications·502 citations·filing 1994–2025
99Inventor score
Files withQUALCOMM INC119QUALCOMM MEMS TECHNOLOGIES INC5ZUO CHENGJIE4YUN CHANGHAN2BLACK JUSTIN PHELPS1
Top patents by PatentIndex Score
136 records- 0198US9449753B2Varying thickness inductorQUALCOMM INC·Filed 2014·Granted Sep 20, 2016·33 cites·25 claims
- 0297US9807882B1Density-optimized module-level inductor ground structureQUALCOMM INC·Filed 2016·Granted Oct 31, 2017·21 cites·20 claims
- 0397US5454270AHermetically sealed pressure sensor and method thereofMOTOROLA INC·Filed 1994·Granted Oct 3, 1995·122 cites·17 claims
- 0496US10685924B2Antenna-on-package arrangementsQUALCOMM INC·Filed 2017·Granted Jun 16, 2020·16 cites·12 claims
- 0595US9893048B2Passive-on-glass (POG) device and methodQUALCOMM INC·Filed 2015·Granted Feb 13, 2018·7 cites·30 claims
- 0694US10433425B1Three-dimensional high quality passive structure with conductive pillar technologyQUALCOMM INC·Filed 2018·Granted Oct 1, 2019·10 cites·16 claims
- 0794US10242957B2Compartment shielding in flip-chip (FC) moduleQUALCOMM INC·Filed 2015·Granted Mar 26, 2019·13 cites·30 claims
- 0894US9959964B2Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 1, 2018·6 cites·25 claims
- 0993US10734332B2High aspect ratio interconnects in air gap of antenna packageQUALCOMM INC·Filed 2017·Granted Aug 4, 2020·9 cites·31 claims
- 1093US10115671B2Incorporation of passives and fine pitch through via for package on packageQUALCOMM MEMS TECHNOLOGIES INC·Filed 2013·Granted Oct 30, 2018·16 cites·34 claims
- 1193US9620463B2Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)QUALCOMM INC·Filed 2015·Granted Apr 11, 2017·10 cites·29 claims
- 1293US9101068B2Two-stage power delivery architectureQUALCOMM INC·Filed 2013·Granted Aug 4, 2015·14 cites·8 claims
- 1392US10325855B2Backside drill embedded die substrateQUALCOMM INC·Filed 2016·Granted Jun 18, 2019·10 cites·28 claims
- 1492US9001031B2Complex passive design with special via implementationLO CHI SHUN·Filed 2012·Granted Apr 7, 2015·17 cites·34 claims
- 1591US11003884B2Fingerprint sensor device and methods thereofQUALCOMM INC·Filed 2017·Granted May 11, 2021·5 cites·39 claims
- 1691US10490880B2Glass-based antenna array packageQUALCOMM INC·Filed 2017·Granted Nov 26, 2019·6 cites·30 claims
- 1791US10292269B1Inductor with metal-insulator-metal (MIM) capacitorQUALCOMM INC·Filed 2018·Granted May 14, 2019·9 cites·20 claims
- 1889US9536805B2Power management integrated circuit (PMIC) integration into a processor packageQUALCOMM INC·Filed 2014·Granted Jan 3, 2017·12 cites·25 claims
- 1989US9370103B2Low package parasitic inductance using a thru-substrate interposerQUALCOMM INC·Filed 2013·Granted Jun 14, 2016·9 cites·11 claims
- 2087US10290414B2Substrate comprising an embedded inductor and a thin film magnetic coreQUALCOMM INC·Filed 2015·Granted May 14, 2019·6 cites·20 claims
- 2187US9425761B2High pass filters and low pass filters using through glass via technologyQUALCOMM INC·Filed 2013·Granted Aug 23, 2016·9 cites·21 claims
- 2287US9203373B2Diplexer design using through glass via technologyQUALCOMM INC·Filed 2013·Granted Dec 1, 2015·8 cites·20 claims
- 2386US10069474B2Encapsulation of acoustic resonator devicesQUALCOMM INC·Filed 2016·Granted Sep 4, 2018·4 cites·30 claims
- 2486US10049815B2Nested through glass via transformerQUALCOMM INC·Filed 2016·Granted Aug 14, 2018·2 cites·21 claims
- 2586US9431473B2Hybrid transformer structure on semiconductor devicesQUALCOMM INC·Filed 2012·Granted Aug 30, 2016·7 cites·48 claims
- 2686US8970516B2Integrated passives and power amplifierBLACK JUSTIN PHELPS·Filed 2011·Granted Mar 3, 2015·11 cites·47 claims
- 2785US9954267B2Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filterQUALCOMM INC·Filed 2016·Granted Apr 24, 2018·4 cites·25 claims
- 2885US9368566B2Package on package (PoP) integrated device comprising a capacitor in a substrateQUALCOMM INC·Filed 2014·Granted Jun 14, 2016·7 cites·20 claims
- 2984US9875848B2MIM capacitor and method of making the sameQUALCOMM INC·Filed 2015·Granted Jan 23, 2018·4 cites·30 claims
- 3084US9099986B2Cross-sectional dilation mode resonatorsZUO CHENGJIE·Filed 2011·Granted Aug 4, 2015·7 cites·32 claims
- 3183US10582609B2Integration of through glass via (TGV) filter and acoustic filterQUALCOMM INC·Filed 2017·Granted Mar 3, 2020·4 cites·19 claims
- 3283US10163771B2Interposer device including at least one transistor and at least one through-substrate viaQUALCOMM INC·Filed 2016·Granted Dec 25, 2018·4 cites·22 claims
- 3383US9813043B2Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methodsQUALCOMM INC·Filed 2016·Granted Nov 7, 2017·3 cites·23 claims
- 3483US9368564B23D pillar inductorQUALCOMM INC·Filed 2014·Granted Jun 14, 2016·5 cites·23 claims
- 3583US9355967B2Stress compensation patterningQUALCOMM INC·Filed 2013·Granted May 31, 2016·5 cites·31 claims
- 3683US9275786B2Superposed structure 3D orthogonal through substrate inductorQUALCOMM INC·Filed 2014·Granted Mar 1, 2016·5 cites·23 claims
- 3782US9966426B2Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 8, 2018·4 cites·20 claims
- 3881US10103135B2Backside ground plane for integrated circuitQUALCOMM INC·Filed 2016·Granted Oct 16, 2018·3 cites·19 claims
- 3980US10490621B1Close proximity tunable inductive elementsQUALCOMM INC·Filed 2018·Granted Nov 26, 2019·3 cites·10 claims
- 4080US9660110B2Varactor device with backside contactQUALCOMM INC·Filed 2014·Granted May 23, 2017·3 cites·30 claims
- 4178US9691694B2Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrateQUALCOMM INC·Filed 2015·Granted Jun 27, 2017·3 cites·33 claims
- 4277US10044390B2Glass substrate including passive-on-glass device and semiconductor dieQUALCOMM INC·Filed 2016·Granted Aug 7, 2018·2 cites·17 claims
- 4377US2025219618A1Wideband filter with resonators and inductorsQUALCOMM INC·Filed 2025·Application pending·0 cites
- 4476US9930783B2Passive device assembly for accurate ground plane controlQUALCOMM INC·Filed 2016·Granted Mar 27, 2018·2 cites·37 claims
- 4576US9906318B2Frequency multiplexerQUALCOMM INC·Filed 2015·Granted Feb 27, 2018·3 cites·24 claims
- 4675US9634640B2Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methodsQUALCOMM INC·Filed 2013·Granted Apr 25, 2017·3 cites·19 claims
- 4774US8633597B2Thermal vias in an integrated circuit package with an embedded dieSWEENEY FIFIN·Filed 2010·Granted Jan 21, 2014·4 cites·29 claims
- 4871US10498307B2Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductorQUALCOMM INC·Filed 2017·Granted Dec 3, 2019·1 cites·24 claims
- 4971US10171112B2RF multiplexer with integrated directional couplersQUALCOMM INC·Filed 2016·Granted Jan 1, 2019·2 cites·16 claims
- 5071US7602050B2Integrated circuit packagingQUALCOMM INC·Filed 2006·Granted Oct 13, 2009·5 cites·29 claims
Showing the top 50 of 136 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →