Inventor · disambiguated record

Chin-Liang Chen

Also filed as: CHEN CHIN-LIANG

73 granted patents·33 pending applications·205 citations·filing 2000–2025

98Inventor score

Technology areasH10W G02B H10P F21V G02F

Files withTAIWAN SEMICONDUCTOR MFG CO LTD66 HENGHAO TECHNOLOGY CO LTD5 CHEN CHIN-LIANG4 DONGGUAN MASSTOP LIQUID CRYSTAL DISPLAY CO LTD4 WINTEK CORP4

Top patents by PatentIndex Score

106 records

0197US10157871B1Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·20 cites·20 claims
0296US10163754B2Lid design for heat dissipation enhancement of die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 25, 2018·31 cites·20 claims
0395US9735043B2Semiconductor packaging structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 15, 2017·16 cites·20 claims
0494US12165946B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·1 cites·15 claims
0594US9865566B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·9 cites·20 claims
0693US9812410B2Lid structure for a semiconductor device package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·7 cites·20 claims
0792US9673119B2System and method for bonding package lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 6, 2017·10 cites·20 claims
0891US11348874B2Semiconductor packages and forming methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
0990US11315862B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·2 cites·20 claims
1090US8916419B2Lid attach process and apparatus for fabrication of semiconductor packagesCHEN CHIN-LIANG·Filed 2012·Granted Dec 23, 2014·11 cites·20 claims
1189US10157863B2Method for forming a lid structure for a semiconductor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·4 cites·20 claims
1288US9786520B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·5 cites·20 claims
1388US2025062184A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1487US10957672B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 23, 2021·3 cites·20 claims
1586US11417643B2Package-on-package with redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 16, 2022·3 cites·20 claims
1685US11824032B2Die corner removal for underfill crack suppression in semiconductor die packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 21, 2023·1 cites·20 claims
1784US11424220B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·1 cites·20 claims
1884US10141201B2Integrated circuit packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 27, 2018·5 cites·20 claims
1983US9287233B2Adhesive pattern for advance package reliability improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 15, 2016·6 cites·19 claims
2081US8894266B2Light guide deviceYE ZHI-TING·Filed 2012·Granted Nov 25, 2014·5 cites·13 claims
2181US2025309083A1Semiconductor structure and circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2281US2025300113A1Die corner removal for underfill crack suppression in semiconductor die packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2380US10157772B2Semiconductor packaging structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·2 cites·20 claims
2480US8009260B2Flexible printed circuit and liquid crystal module using the sameWINTEK CORP·Filed 2009·Granted Aug 30, 2011·6 cites·10 claims
2580US2024387457A1Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2679US12062604B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
2779US11784106B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
2879US2025349685A1Package structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2979US2024363544A1Semiconductor packages and forming methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3079US2025349684A1Semiconductor Device Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3178US12347802B2Die corner removal for underfill crack suppression in semiconductor die packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
3278US11908835B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
3377US12417969B2Semiconductor structure and circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
3477US11616037B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 28, 2023·0 cites·20 claims
3576US10276508B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·20 claims
3675US12062619B2Semiconductor packages and forming methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
3775US10804245B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 13, 2020·1 cites·8 claims
3875US10700031B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·1 cites·20 claims
3975US9941186B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·1 cites·18 claims
4074US11749594B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·0 cites·20 claims
4174US8016476B2Back light moduleWINTEK CORP·Filed 2009·Granted Sep 13, 2011·4 cites·13 claims
4273US9893043B2Method of manufacturing a chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 13, 2018·3 cites·20 claims
4372US11264304B2Semiconductor structure and associated method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
4471US11972956B2Lid attach process and dispenser headTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 30, 2024·0 cites·24 claims
4571US11508640B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·14 claims
4671US11355461B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·0 cites·20 claims
4770US11594479B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
4870US9209046B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·2 cites·15 claims
4970US2022301889A1Integrated Circuit Packages and Methods of Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
5069US12417968B2Package structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims

Showing the top 50 of 106 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →