Inventor · disambiguated record
Philipp Engesser
Also filed as: ENGESSER PHILIPP
13 granted patents·47 citations·filing 2001–2021
88Inventor score
Top patents by PatentIndex Score
13 records- 0182US9136155B2Method and device for processing wafer shaped articlesKINOSHITA KEI·Filed 2011·Granted Sep 15, 2015·8 cites·15 claims
- 0278US9748120B2Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatusLAM RES AG·Filed 2013·Granted Aug 29, 2017·6 cites·11 claims
- 0378US7988818B2Device for liquid treatment of wafer-shaped articlesLAM RES AG·Filed 2006·Granted Aug 2, 2011·5 cites·10 claims
- 0476US7172674B2Device for liquid treatment of wafer-shaped articlesSEZ AG·Filed 2001·Granted Feb 6, 2007·17 cites·32 claims
- 0572US9870933B2Process and apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2013·Granted Jan 16, 2018·4 cites·1 claims
- 0669US9597701B2Apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2013·Granted Mar 21, 2017·2 cites·9 claims
- 0768US11164748B2Method and device for plating a recess in a substrateSEMSYSCO GMBH·Filed 2019·Granted Nov 2, 2021·1 cites·12 claims
- 0864US11908698B2Method and device for plating a recess in a substrateSEMSYSCO GMBH·Filed 2021·Granted Feb 20, 2024·0 cites·18 claims
- 0959US12351921B2Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2020·Granted Jul 8, 2025·0 cites·21 claims
- 1056US7799695B2Device for liquid treatment of wafer-shaped articlesLAM RES AG·Filed 2004·Granted Sep 21, 2010·4 cites·7 claims
- 1146US9960057B2Device for measuring the distribution or impulse of a series of dropletsLAM RES AG·Filed 2014·Granted May 1, 2018·0 cites·3 claims
- 1242US8038804B2Method for drying a surfaceLAM RES AG·Filed 2006·Granted Oct 18, 2011·0 cites·15 claims
- 1335US10249521B2Wet-dry integrated wafer processing systemLAM RES AG·Filed 2016·Granted Apr 2, 2019·0 cites·20 claims
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