Inventor · disambiguated record
Nobuhiro Misawa
Also filed as: MISAWA NOBUHIRO
15 granted patents·2 pending applications·213 citations·filing 1990–2019
92Inventor score
Files withFUJITSU LTD6WATANABE KENICHI3FUJITSU SEMICONDUCTOR LTD2MIE FUJITSU SEMICONDUCTOR LTD2UNITED SEMICONDUCTOR JAPAN CO LTD2
Top patents by PatentIndex Score
17 records- 0195US7939913B2Semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2009·Granted May 10, 2011·29 cites·20 claims
- 0289US5470789AProcess for fabricating integrated circuit devicesFUJITSU LTD·Filed 1995·Granted Nov 28, 1995·115 cites·16 claims
- 0376US8937007B2Semiconductor deviceWATANABE KENICHI·Filed 2012·Granted Jan 20, 2015·3 cites·16 claims
- 0473US10014363B2Semiconductor device having resistance elements and fabrication method thereofMIE FUJITSU SEMICONDUCTOR LTD·Filed 2017·Granted Jul 3, 2018·1 cites·9 claims
- 0571US8143153B2Method for manufacturing semiconductor deviceWATANABE KENICHI·Filed 2011·Granted Mar 27, 2012·2 cites·5 claims
- 0664US7338905B2Semiconductor device manufacture methodFUJITSU LTD·Filed 2004·Granted Mar 4, 2008·8 cites·8 claims
- 0763US10840323B2Method of fabricating semiconductor device having resistance elementsUNITED SEMICONDUCTOR JAPAN CO LTD·Filed 2019·Granted Nov 17, 2020·0 cites·21 claims
- 0863US10720489B2Semiconductor device having resistance elements and fabrication method thereofUNITED SEMICONDUCTOR JAPAN CO LTD·Filed 2019·Granted Jul 21, 2020·0 cites·20 claims
- 0959US10510824B2Semiconductor device having resistance elements and fabrication method thereofMIE FUJITSU SEMICONDUCTOR LTD·Filed 2018·Granted Dec 17, 2019·0 cites·10 claims
- 1058US6440844B1Semiconductor device with copper wiring and its manufacture methodFUJITSU LTD·Filed 1998·Granted Aug 27, 2002·27 cites·21 claims
- 1152US9165827B2Semiconductor device and method of manufacturing semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Oct 20, 2015·0 cites·5 claims
- 1252US2008119050A1Semiconductor device manufacture methodFUJITSU LTD·Filed 2008·Application pending·0 cites
- 1347US8698279B2Semiconductor device including capacitor of interconnectionWATANABE KENICHI·Filed 2010·Granted Apr 15, 2014·0 cites·9 claims
- 1446US5264038AChemical vapor deposition systemFUJITSU LTD·Filed 1990·Granted Nov 23, 1993·13 cites·10 claims
- 1546US2011104624A1Method and apparatus of controlling combustion in oxyfuel combustion boilerIHI CORP·Filed 2008·Application pending·0 cites
- 1645US5589425AProcess of selective area chemical vapor deposition of metal filmsFUJITSU LTD·Filed 1994·Granted Dec 31, 1996·15 cites·5 claims
- 1741US8735945B2Semiconductor deviceSHIMA MASASHI·Filed 2011·Granted May 27, 2014·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →