Inventor · disambiguated record
Zhengyu Zhu
Also filed as: ZHU ZHENGYU
3 granted patents·2 pending applications·23 citations·filing 2007–2018
68Inventor score
Top patents by PatentIndex Score
5 records- 0181US7589338B2Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of diceFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Sep 15, 2009·12 cites·26 claims
- 0271US9147665B2High bond line thickness for semiconductor devicesZHU ZHENGYU·Filed 2010·Granted Sep 29, 2015·6 cites·8 claims
- 0367US7825501B2High bond line thickness for semiconductor devicesFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Nov 2, 2010·5 cites·14 claims
- 0443US2012232944A1Resource skill compliance optimizationZHU ZHENGYU·Filed 2011·Application pending·0 cites
- 0542US2020331088A1Repairing methods for hydraulic-end valve cage cavity and plunger-end seal holeShanghai qinghe machinery co ltd·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →