Inventor · disambiguated record
Hideki Ishigami
Also filed as: ISHIGAMI HIDEKI
6 granted patents·8 pending applications·12 citations·filing 2009–2023
75Inventor score
Top patents by PatentIndex Score
14 records- 0182US9597767B2Polishing media, method for producing polishing media, and polishing methodISHIGAMI HIDEKI·Filed 2012·Granted Mar 21, 2017·4 cites·6 claims
- 0281US9219218B2Method of manufacturing electric wiring layer, member for forming electric wiring layer, electric wiring layer, method of manufacturing electric wiring board, member for forming electric wiring board, electric wiring board, vibrator, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2014·Granted Dec 22, 2015·3 cites·18 claims
- 0370US9954160B2Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2014·Granted Apr 24, 2018·3 cites·14 claims
- 0461US8420006B2Method of manufacturing translucent ceramic and orthodontic memberSAKATA MASAAKI·Filed 2009·Granted Apr 16, 2013·2 cites·16 claims
- 0556US2023311409A1Method For Manufacturing Three-Dimensional Shaped Object, And Three-Dimensional Shaping ApparatusSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0649US2015114178A1Metal powder for powder metallurgy, compound, granulated powder, and sintered bodySEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 0749US2013256957A1Translucent alumina and method for producing translucent aluminaSEIKO EPSON CORP·Filed 2013·Application pending·0 cites
- 0847US9769934B2Package base, package, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2015·Granted Sep 19, 2017·0 cites·12 claims
- 0941US2015070855A1Circuit board, method for manufacturing circuit board, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 1040US2015216637A1Dental component, metal powder for powder metallurgy, and method for producing dental componentSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 1139US2015217371A1Manufacturing method of compact, manufacturing method of structure, and cutting processed materialSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 1238US9073121B2Method for producing sintered compactNAKAMURA HIDEFUMI·Filed 2011·Granted Jul 7, 2015·0 cites·8 claims
- 1338US2011314964A1Binder composition for powder metallurgy, compound for powder metallurgy, and sintered bodyISHIGAMI HIDEKI·Filed 2011·Application pending·0 cites
- 1429US2015223325A1Wiring board, method of manufacturing wiring board, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →