Inventor · disambiguated record
Ajit K. Trivedi
Also filed as: TRIVEDI AJIT · TRIVEDI AJIT K · TRIVEDI AJIT KUMAR
23 granted patents·826 citations·filing 1993–2004
97Inventor score
Files withIBM23
Top patents by PatentIndex Score
23 records- 0196US6674647B2Low or no-force bump flattening structure and methodIBM·Filed 2002·Granted Jan 6, 2004·92 cites·5 claims
- 0294US6559666B2Method and device for semiconductor testing using electrically conductive adhesivesIBM·Filed 2001·Granted May 6, 2003·80 cites·16 claims
- 0391US6034875ACooling structure for electronic componentsIBM·Filed 1998·Granted Mar 7, 2000·80 cites·17 claims
- 0491US5384690AFlex laminate package for a parallel processorIBM·Filed 1993·Granted Jan 24, 1995·61 cites·11 claims
- 0590US6437254B1Apparatus and method for printed circuit board repairIBM·Filed 2001·Granted Aug 20, 2002·46 cites·3 claims
- 0689US5620782AMethod of fabricating a flex laminate packageIBM·Filed 1995·Granted Apr 15, 1997·59 cites·1 claims
- 0785US5685070AMethod of making printed circuit boardIBM·Filed 1995·Granted Nov 11, 1997·75 cites·6 claims
- 0885US5435480AMethod for filling plated through holesIBM·Filed 1993·Granted Jul 25, 1995·67 cites·12 claims
- 0984US5418689APrinted circuit board or card for direct chip attachment and fabrication thereofIBM·Filed 1993·Granted May 23, 1995·67 cites·6 claims
- 1071US5809641AMethod for printed circuit board repairIBM·Filed 1996·Granted Sep 22, 1998·28 cites·6 claims
- 1168US6268739B1Method and device for semiconductor testing using electrically conductive adhesivesIBM·Filed 2000·Granted Jul 31, 2001·12 cites·9 claims
- 1268US5509196AMethod of fabricating a flex laminate packageIBM·Filed 1994·Granted Apr 23, 1996·24 cites·3 claims
- 1361US6288559B1Semiconductor testing using electrically conductive adhesivesIBM·Filed 1998·Granted Sep 11, 2001·20 cites·17 claims
- 1461US5959348AConstruction of PBGA substrate for flip chip packingIBM·Filed 1997·Granted Sep 28, 1999·25 cites·5 claims
- 1560US6453537B1Cooling method for electronic componentsIBM·Filed 1999·Granted Sep 24, 2002·19 cites·35 claims
- 1659US6829149B1Placement of sacrificial solder balls underneath the PBGA substrateIBM·Filed 1997·Granted Dec 7, 2004·17 cites·4 claims
- 1754US7227268B2Placement of sacrificial solder balls underneath the PBGA substrateIBM·Filed 2004·Granted Jun 5, 2007·3 cites·16 claims
- 1851US6492071B1Wafer scale encapsulation for integrated flip chip and surface mount technology assemblyIBM·Filed 2000·Granted Dec 10, 2002·4 cites·19 claims
- 1951US6115912AApparatus and method for printed circuit board repairIBM·Filed 1999·Granted Sep 12, 2000·11 cites·5 claims
- 2048US6353182B1Proper choice of the encapsulant volumetric CTE for different PGBA substratesIBM·Filed 1998·Granted Mar 5, 2002·14 cites·10 claims
- 2146US6255599B1Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delaminationIBM·Filed 1997·Granted Jul 3, 2001·12 cites·20 claims
- 2241US6295724B1Apparatus for printed circuit board repairIBM·Filed 1999·Granted Oct 2, 2001·6 cites·6 claims
- 2336US6018866AApparatus and method for printed circuit board repairIBM·Filed 1998·Granted Feb 1, 2000·4 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →