Inventor · disambiguated record
Keum-Hee Ma
Also filed as: MA KEUM-HEE
16 granted patents·10 pending applications·164 citations·filing 2004–2025
93Inventor score
Top patents by PatentIndex Score
26 records- 0195US7262475B2Image sensor device and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 28, 2007·30 cites·8 claims
- 0291US9515057B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 6, 2016·13 cites·18 claims
- 0389US7777323B2Semiconductor structure and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 17, 2010·19 cites·22 claims
- 0489US7588964B2Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 15, 2009·18 cites·13 claims
- 0587US7459774B2Stacked chip package using photosensitive polymer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 2, 2008·23 cites·13 claims
- 0686US9245771B2Semiconductor packages having through electrodes and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 26, 2016·8 cites·30 claims
- 0786US8513802B2Multi-chip package having semiconductor chips of different thicknesses from each other and related deviceMA KEUM-HEE·Filed 2011·Granted Aug 20, 2013·14 cites·22 claims
- 0886US8373261B2Chip stack package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Feb 12, 2013·9 cites·15 claims
- 0973US8114772B2Method of manufacturing the semiconductor deviceLEE KYU-HA·Filed 2010·Granted Feb 14, 2012·6 cites·20 claims
- 1071US7534656B2Image sensor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 19, 2009·2 cites·12 claims
- 1170US2025226340A1Semiconductor chip and semiconductor package including the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1269US12288762B2Semiconductor chip with signal bump and dummy bump, semiconductor package including the semiconductor chip and method for manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·20 claims
- 1368US8183673B2Through-silicon via structures providing reduced solder spreading and methods of fabricating the sameHWANG SON-KWAN·Filed 2009·Granted May 22, 2012·5 cites·30 claims
- 1467US7524763B2Fabrication method of wafer level chip scale packagesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 28, 2009·4 cites·12 claims
- 1561US7300864B2Method for forming solder bump structureSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 27, 2007·9 cites·20 claims
- 1658US7521657B2Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 21, 2009·2 cites·21 claims
- 1758US7371614B2Image sensor device and methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 13, 2008·2 cites·20 claims
- 1847US2010081236A1Method of manufacturing semiconductor device with embedded interposerSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1947US2009186446A1Semiconductor device packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2046US2008318363A1Stack circuit member and methodKWON YONG-CHAI·Filed 2008·Application pending·0 cites
- 2146US2015228591A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2245US2008179727A1Semiconductor packages having immunity against void due to adhesive material and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2344US2014252605A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2444US2008001289A1Stacked-type wafer level package, method of manufacturing the same, wafer-level stack package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2542US2006278991A1Stack circuit member and methodKWON YONG-CHAI·Filed 2005·Application pending·0 cites
- 2640US2007007641A1Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structureLEE KANG-WOOK·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →