Inventor · disambiguated record
Masami Yusa
Also filed as: YUSA MASAMI
35 granted patents·5 pending applications·526 citations·filing 1988–2012
97Inventor score
Files withHITACHI CHEMICAL CO LTD30KATOGI SHIGEKI4FUJINAWA TOHRU2MASUKO TAKASHI2HITACHI COMPANY LTD1
Top patents by PatentIndex Score
40 records- 0193US7141645B2Wiring-connecting material and wiring-connected board production process using the sameHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 28, 2006·36 cites·6 claims
- 0285US6762249B1Wiring-connecting material and process for producing circuit board with the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jul 13, 2004·39 cites·21 claims
- 0385US6064111ASubstrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor packageHITACHI COMPANY LTD·Filed 1997·Granted May 16, 2000·84 cites·11 claims
- 0485US4833204AEpoxy resin composition for a copper-clad laminateHITACHI CHEMICAL CO LTD·Filed 1988·Granted May 23, 1989·33 cites·5 claims
- 0578US7208105B2Adhesive for circuit connection, circuit connection method using the same, and circuit connection structureHITACHI CHEMICAL CO LTD·Filed 2001·Granted Apr 24, 2007·16 cites·13 claims
- 0678US6236108B1Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor packageHITACHI CHEMICAL CO LTD·Filed 2000·Granted May 22, 2001·24 cites·14 claims
- 0778US6099678ALaminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1995·Granted Aug 8, 2000·61 cites·36 claims
- 0878US5667899AElectrically conductive bonding filmsHITACHI CHEMICAL CO LTD·Filed 1995·Granted Sep 16, 1997·35 cites·7 claims
- 0977US8029911B2Adhesive for circuit connection, circuit connection method using the same, and circuit connected structureHITACHI CHEMICAL CO LTD·Filed 2010·Granted Oct 4, 2011·4 cites·12 claims
- 1072US5243019AAlkenyl-fluorine-containing aromatic polyamideHITACHI CHEMICAL CO LTD·Filed 1991·Granted Sep 7, 1993·18 cites·8 claims
- 1171US5605763AElectrically conductive bonding filmsHITACHI CHEMICAL CO LTD·Filed 1995·Granted Feb 25, 1997·40 cites·9 claims
- 1271US5571579AAlignment film for liquid crystal, liquid crystal-sandwiched panel, liquid crystal display module and material for liquid crystal alignment filmHITACHI CHEMICAL CO LTD·Filed 1994·Granted Nov 5, 1996·26 cites·14 claims
- 1370US7258918B2Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structureHITACHI CHEMICAL CO LTD·Filed 2003·Granted Aug 21, 2007·13 cites·19 claims
- 1470US5270438AFluorine-containing polyimides and precursors thereofHITACHI CHEMICAL CO LTD·Filed 1991·Granted Dec 14, 1993·14 cites·20 claims
- 1569US6825249B1Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2000·Granted Nov 30, 2004·17 cites·16 claims
- 1667US7387914B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jun 17, 2008·2 cites·14 claims
- 1766US6717242B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Apr 6, 2004·12 cites·6 claims
- 1865US7795325B2Adhesive composition, adhesive composition for circuit connection, connected body semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2009·Granted Sep 14, 2010·0 cites·9 claims
- 1965US5115089AProcesses for preparation of polyimide-isoindroquinazolinedione and precursor thereofHITACHI CHEMICAL CO LTD·Filed 1988·Granted May 19, 1992·14 cites·13 claims
- 2064US7771559B2Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structureHITACHI CHEMICAL CO LTD·Filed 2006·Granted Aug 10, 2010·2 cites·12 claims
- 2162US8293847B2Film-like adhesive, adhesive sheet, and semiconductor device using sameMASUKO TAKASHI·Filed 2006·Granted Oct 23, 2012·2 cites·12 claims
- 2261US8138268B2Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2005·Granted Mar 20, 2012·2 cites·13 claims
- 2361US6841628B2Resin composition, adhesives prepared therewith for bonding circuit members, and circuit boardsHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jan 11, 2005·5 cites·25 claims
- 2460US6855579B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Feb 15, 2005·6 cites·14 claims
- 2559US8518303B2Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2006·Granted Aug 27, 2013·2 cites·15 claims
- 2657US7576141B2Adhesive composition, adhesive composition for circuit connection, connected body semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2005·Granted Aug 18, 2009·2 cites·13 claims
- 2754US7781896B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2008·Granted Aug 24, 2010·0 cites·3 claims
- 2853US7057265B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jun 6, 2006·3 cites·13 claims
- 2951US8309658B2Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2011·Granted Nov 13, 2012·0 cites·10 claims
- 3050US7528488B2Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structureHITACHI CHEMICAL CO LTD·Filed 2006·Granted May 5, 2009·0 cites·7 claims
- 3150US7078094B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jul 18, 2006·2 cites·27 claims
- 3249US2006252843A1Wiring-connecting material and wiring-connected board production process using the sameFUJINAWA TOHRU·Filed 2006·Application pending·0 cites
- 3348US8696942B2Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2012·Granted Apr 15, 2014·0 cites·13 claims
- 3448US2007166549A1Adhesive for circuit connection, circuit connection method using the same, and circuit connected structureNOMURA SATOYUKI·Filed 2007·Application pending·0 cites
- 3548US2010265685A1Wiring-connecting material and wiring-connected board production process using the sameFUJINAWA TOHRU·Filed 2010·Application pending·0 cites
- 3647US7012320B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 14, 2006·2 cites·42 claims
- 3742US2011193244A1Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor deviceMASUKO TAKASHI·Filed 2011·Application pending·0 cites
- 3841US6331729B1Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing themHITACHI CHEMICAL CO LTD·Filed 1997·Granted Dec 18, 2001·10 cites·3 claims
- 3939US2007098995A1Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2004·Application pending·0 cites
- 4031US5401878AFluorine-containing polyimides and precursors thereofHITACHI CHEMICAL CO LTD·Filed 1993·Granted Mar 28, 1995·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →