Inventor · disambiguated record
Hidemichi Furihata
Also filed as: FURIHATA HIDEMICHI
16 granted patents·11 pending applications·45 citations·filing 2000–2020
89Inventor score
Top patents by PatentIndex Score
27 records- 0189US7425474B2Method of manufacturing thin film transistor, method of manufacturing electro-optical device thin film transistor, and electro-optical deviceSEIKO EPSON CORP·Filed 2005·Granted Sep 16, 2008·14 cites·9 claims
- 0282US7404885B2Plating method and electronic deviceSEIKO EPSON CORP·Filed 2006·Granted Jul 29, 2008·4 cites·8 claims
- 0380US9254657B1Flow path component, liquid discharge head, and liquid discharge apparatusSEIKO EPSON CORP·Filed 2015·Granted Feb 9, 2016·2 cites·12 claims
- 0478US7305761B2Method for manufacturing wiring substrateSEIKO EPSON CORP·Filed 2005·Granted Dec 11, 2007·8 cites·10 claims
- 0572US7521361B2Method for manufacturing wiring substrateSEIKO EPSON CORP·Filed 2007·Granted Apr 21, 2009·1 cites·15 claims
- 0667US7361594B2Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatusSEIKO EPSON CORP·Filed 2004·Granted Apr 22, 2008·12 cites·18 claims
- 0761US6515953B1Processing method of a master disc for optical discs and processing method of groovesSEIKO EPSON CORP·Filed 2000·Granted Feb 4, 2003·4 cites·10 claims
- 0859US10700258B2Piezoelectric element, manufacturing method thereof, and liquid ejection headSEIKO EPSON CORP·Filed 2018·Granted Jun 30, 2020·0 cites·7 claims
- 0955US11312137B2Piezoelectric element, liquid discharge head, and printerSEIKO EPSON CORP·Filed 2020·Granted Apr 26, 2022·0 cites·4 claims
- 1055US11133454B2Piezoelectric element, liquid discharge head, and printerSEIKO EPSON CORP·Filed 2020·Granted Sep 28, 2021·0 cites·9 claims
- 1154US2008299356A1Plated substrate and its fabrication methodSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 1253US8636343B2Liquid ejecting head, liquid ejecting apparatus, and piezoelectric elementSEIKO EPSON CORP·Filed 2012·Granted Jan 28, 2014·0 cites·4 claims
- 1352US2007218192A1Method of manufacturing interconnect substrateSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 1449US8012449B2Method of manufacturing complex metal oxide powder and amorphous complex metal oxideSEIKO EPSON CORP·Filed 2007·Granted Sep 6, 2011·0 cites·10 claims
- 1549US7597813B2Element substrate and method of manufacturing the sameSEIKO EPSON CORP·Filed 2007·Granted Oct 6, 2009·0 cites·8 claims
- 1649US2008274338A1Wiring substrate and method for manufacturing the sameSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 1748US7966720B2Method of manufacturing an element substrateSEIKO EPSON CORP·Filed 2007·Granted Jun 28, 2011·0 cites·6 claims
- 1848US2008173471A1Element substrate and method of manufacturing the sameSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 1946US2007218191A1Method for manufacturing wiring substrateSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 2044US7488678B2Method of manufacturing interconnect substrateSEIKO EPSON CORP·Filed 2007·Granted Feb 10, 2009·0 cites·11 claims
- 2143US2007218193A1Method of manufacturing interconnect substrateSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 2242US2008081155A1Plated substrate and method of manufacturing the sameSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 2340US2005170622A1Method for manufacturing wiring substrate and method for manufacturing electronic deviceFiled 2005·Application pending·0 cites
- 2436US7604835B2Method for manufacturing wiring substrate and method for manufacturing electronic deviceSEIKO EPSON CORP·Filed 2005·Granted Oct 20, 2009·0 cites·4 claims
- 2535US2018076381A1Method for producing piezoelectric element, piezoelectric element, piezoelectric drive device, robot, and pumpSEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 2634US2005245004A1Method for manufacturing wiring substrate and method for manufacturing electronic deviceKIMURA SATOSHI·Filed 2005·Application pending·0 cites
- 2732US2005170079A1Method for manufacturing wiring substrate and method for manufacturing electronic deviceFiled 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →