Inventor · disambiguated record
Sungwoo Joo
Also filed as: JOO Sungwoo
2 granted patents·0 citations·filing 2017–2018
28Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0149US10446471B2Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 15, 2019·0 cites·17 claims
- 0244US10177072B2Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the packagePARK JAEHONG·Filed 2017·Granted Jan 8, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →