Inventor · disambiguated record
Demei Gong
Also filed as: GONG DEMEI
4 granted patents·2 pending applications·19 citations·filing 2005–2014
68Inventor score
Top patents by PatentIndex Score
6 records- 0185US8159828B2Low profile flip chip power module and method of makingSUN MING·Filed 2007·Granted Apr 17, 2012·15 cites·5 claims
- 0267US7202113B2Wafer level bumpless method of making a flip chip mounted semiconductor device packageSUN MING·Filed 2005·Granted Apr 10, 2007·4 cites·14 claims
- 0347US7466014B2Flip chip mounted semiconductor device package having a dimpled leadframeSUN MING·Filed 2007·Granted Dec 16, 2008·0 cites·5 claims
- 0445US2012167384A1Method of Making a Low Profile Flip Chip Power ModuleSUN MING·Filed 2012·Application pending·0 cites
- 0544US9337131B2Power semiconductor device and the preparation methodALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted May 10, 2016·0 cites·6 claims
- 0639US2007148875A1Common drain dual semiconductor chip scale package and method of fabricating sameSUN MING·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →