Inventor · disambiguated record
Byeonghoon Kim
Also filed as: KIM BYEONGHOON
6 granted patents·1 pending application·8 citations·filing 2011–2023
74Inventor score
Top patents by PatentIndex Score
7 records- 0188US11355452B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 7, 2022·2 cites·24 claims
- 0272US9373513B2Methods of manufacturing semiconductor devices including variable width floating gatesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 21, 2016·2 cites·10 claims
- 0370US11688697B2Emi shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jun 27, 2023·0 cites·21 claims
- 0466US9171854B2Semiconductor devices including variable width floating gatesKIM HYOJOONG·Filed 2013·Granted Oct 27, 2015·3 cites·8 claims
- 0549US2024011154A1Substrate processing tube, substrate processing apparatus including the same, and substrate processing method using the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0647US8493768B2Memory cell and memory device using the sameBYUN CHUNWON·Filed 2011·Granted Jul 23, 2013·1 cites·18 claims
- 0734US11715653B2Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 1, 2023·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →