Inventor · disambiguated record
Thibaut Maurice
Also filed as: MAURICE THIBAUT
7 granted patents·4 pending applications·172 citations·filing 2002–2009
87Inventor score
Top patents by PatentIndex Score
11 records- 0191US6815309B2Support-integrated donor wafers for repeated thin donor layer separationSOITEC SILICON ON INSULATOR·Filed 2002·Granted Nov 9, 2004·57 cites·24 claims
- 0287US6908828B2Support-integrated donor wafers for repeated thin donor layer separationSOITEC SILICON ON INSULATOR·Filed 2004·Granted Jun 21, 2005·42 cites·21 claims
- 0383US7022586B2Method for recycling a substrateSOITEC SILICON ON INSULATOR·Filed 2003·Granted Apr 4, 2006·34 cites·29 claims
- 0470US6838358B2Method of manufacturing a waferSOITEC SILICON ON INSULATOR·Filed 2003·Granted Jan 4, 2005·17 cites·24 claims
- 0566US6936523B2Two-stage annealing method for manufacturing semiconductor substratesCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2003·Granted Aug 30, 2005·15 cites·23 claims
- 0661US7217639B2Method of manufacturing a material compound waferSOITEC SILICON ON INSULATOR·Filed 2004·Granted May 15, 2007·7 cites·21 claims
- 0754US2010164048A1Method for fabricating a semiconductor substrate and semiconductor substrateSOITEC SILICON ON INSULATOR·Filed 2009·Application pending·0 cites
- 0848US2007105246A1Method of manufacturing a material compound waferSOITEC SILICON ON INSULATOR·Filed 2006·Application pending·0 cites
- 0938US7256103B2Method for manufacturing a compound material waferSOITEC SILICON ON INSULATOR·Filed 2004·Granted Aug 14, 2007·0 cites·17 claims
- 1033US2005130393A1Method for improving the quality of heterostructureFiled 2004·Application pending·0 cites
- 1126US2004241461A1Preparation method for protecting the back surface of a wafer and back surface protected waferFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →