Inventor · disambiguated record
Hisae Uchiyama
Also filed as: UCHIYAMA HISAE
3 granted patents·10 pending applications·6 citations·filing 2006–2011
57Inventor score
Top patents by PatentIndex Score
13 records- 0178US8592844B2Light-emitting diode deviceIZUTANI SEIJI·Filed 2011·Granted Nov 26, 2013·5 cites·7 claims
- 0255US8749978B2Power moduleIZUTANI SEIJI·Filed 2011·Granted Jun 10, 2014·1 cites·4 claims
- 0342US8547465B2Imaging device moduleIZUTANI SEIJI·Filed 2011·Granted Oct 1, 2013·0 cites·3 claims
- 0442US2006159898A1Semi-conducting resin composition, and wired circuit boardNITTO DENKO CORP·Filed 2006·Application pending·0 cites
- 0541US2011259567A1Thermal conductive sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 0640US2011129677A1Organic-inorganic composite and manufacturing method thereforNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 0739US2011259564A1Thermal conductive sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 0836US2011262728A1Thermal conductive sheet, light-emitting diode mounting substrate, and thermal conductive adhesive sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 0935US2011259569A1Thermal conductive sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1035US2011267557A1Back light and liquid crystal display deviceNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1135US2011259568A1Thermal conductive sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1235US2011259566A1Thermal conductive sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1332US2011259565A1Heat dissipation structureNITTO DENKO CORP·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →