Inventor · disambiguated record
Milton L. Buschbom
Also filed as: BUSCHBOM MILTON L · BUSCHBOM MILTON LEE
9 granted patents·1 pending application·420 citations·filing 1996–2006
90Inventor score
Files withTEXAS INSTRUMENTS INC9
Top patents by PatentIndex Score
10 records- 0198US6683380B2Integrated circuit with bonding layer over active circuitryTEXAS INSTRUMENTS INC·Filed 2002·Granted Jan 27, 2004·274 cites·11 claims
- 0277US7135759B2Individualized low parasitic power distribution lines deposited over active integrated circuitsTEXAS INSTRUMENTS INC·Filed 2001·Granted Nov 14, 2006·21 cites·26 claims
- 0376US5834335ANon-metallurgical connection between an integrated circuit and a circuit board or another integrated circuitTEXAS INSTRUMENTS INC·Filed 1996·Granted Nov 10, 1998·54 cites·20 claims
- 0474US7514292B2Individualized low parasitic power distribution lines deposited over active integrated circuitsTEXAS INSTRUMENTS INC·Filed 2006·Granted Apr 7, 2009·5 cites·5 claims
- 0573US6800944B2Power/ground ring substrate for integrated circuitsTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 5, 2004·21 cites·26 claims
- 0667US5982186AContactor for test applications including membrane carrier having contacts for an integrated circuit and pins connecting contacts to test boardTEXAS INSTRUMENTS INC·Filed 1996·Granted Nov 9, 1999·28 cites·18 claims
- 0761US6586676B2Plastic chip-scale package having integrated passive componentsTEXAS INSTRUMENTS INC·Filed 2001·Granted Jul 1, 2003·9 cites·15 claims
- 0854US6916689B2Plastic chip-scale package having integrated passive componentsTEXAS INSTRUMENTS INC·Filed 2003·Granted Jul 12, 2005·5 cites·15 claims
- 0935US2002084521A1Flip-chip on film assembly for ball grid array packagesFiled 2001·Application pending·0 cites
- 1031US5892274APrinted circuit board ground plane and high frequency semiconductor combinationTEXAS INSTRUMENTS INC·Filed 1997·Granted Apr 6, 1999·3 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →