Inventor · disambiguated record
Andrew Zeng
Also filed as: ZENG ANDREW · ZENG ANDREW AN
13 granted patents·2 pending applications·239 citations·filing 2000–2019
91Inventor score
Top patents by PatentIndex Score
15 records- 0196US6538730B2Defect detection systemKLA TENCOR TECH CORP·Filed 2001·Granted Mar 25, 2003·139 cites·65 claims
- 0292US9121684B2Method for reducing wafer shape and thickness measurement errors resulted from cavity shape changesKLA TENCOR CORP·Filed 2013·Granted Sep 1, 2015·16 cites·19 claims
- 0385US6862096B2Defect detection systemKLA TENCOR CORP·Filed 2003·Granted Mar 1, 2005·22 cites·5 claims
- 0484US6590645B1System and methods for classifying anomalies of sample surfacesKLA TENCOR CORP·Filed 2000·Granted Jul 8, 2003·26 cites·64 claims
- 0579US10571248B2Transparent film error correction pattern in wafer geometry systemKLA TENCOR CORP·Filed 2017·Granted Feb 25, 2020·3 cites·17 claims
- 0678US7038772B2System and methods for classifying anomalies of sample surfacesKLA TENCOR CORP·Filed 2003·Granted May 2, 2006·16 cites·16 claims
- 0777US10705026B2Scanning differential interference contrast in an imaging system designKLA CORP·Filed 2019·Granted Jul 7, 2020·2 cites·20 claims
- 0877US7315365B2System and methods for classifying anomalies of sample surfacesKLA TENCOR CORP·Filed 2006·Granted Jan 1, 2008·4 cites·112 claims
- 0968US7016031B2System and methods for classifying anomalies of sample surfacesKLA TENCOR CORP·Filed 2004·Granted Mar 21, 2006·9 cites·66 claims
- 1063US8630479B2Methods and systems for improved localized feature quantification in surface metrology toolsCHEN HAIGUANG·Filed 2011·Granted Jan 14, 2014·2 cites·19 claims
- 1152US2005018181A1Defect detection systemFiled 2004·Application pending·0 cites
- 1250US11017520B2Multi-wavelength interferometry for defect classificationKLA CORP·Filed 2019·Granted May 25, 2021·0 cites·27 claims
- 1346US9279663B2Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrateWANG CHUNHAI·Filed 2012·Granted Mar 8, 2016·0 cites·20 claims
- 1441US10236222B2System and method for measuring substrate and film thickness distributionKLA TENCOR CORP·Filed 2017·Granted Mar 19, 2019·0 cites·18 claims
- 1533US2015192404A1Reducing registration error of front and back wafer surfaces utilizing a see-through calibration waferKLA TENCOR CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →