Inventor · disambiguated record
Yoshihisa Takada
Also filed as: TAKADA YOSHIHISA
16 granted patents·4 pending applications·178 citations·filing 1999–2025
92Inventor score
Top patents by PatentIndex Score
20 records- 0196US6517955B1High strength galvanized steel plate excellent in adhesion of plated metal and formability in press working and high strength alloy galvanized steel plate and method for production thereofNIPPON STEEL CORP·Filed 1999·Granted Feb 11, 2003·90 cites·15 claims
- 0292US7736449B2High-strength hot-dip galvanized steel sheet and method for producing the sameNIPPON STEEL CORP·Filed 2007·Granted Jun 15, 2010·14 cites·10 claims
- 0387US9559028B2Semiconductor deviceROHM CO LTD·Filed 2015·Granted Jan 31, 2017·5 cites·19 claims
- 0487US2025336819A1Terminal and semiconductor deviceROHM CO LTD·Filed 2025·Application pending·0 cites
- 0579US12374622B2Semiconductor device with improved internal and external electrode structureROHM CO LTD·Filed 2023·Granted Jul 29, 2025·0 cites·19 claims
- 0678US7687152B2High strength molten zinc plated steel sheet and process of production of sameNIPPON STEEL CORP·Filed 2004·Granted Mar 30, 2010·12 cites·1 claims
- 0776US11705399B2Terminal configuration and semiconductor deviceROHM CO LTD·Filed 2022·Granted Jul 18, 2023·0 cites·18 claims
- 0874US7294412B2High-strength hop-dip galvanized steel sheetNIPPON STEEL CORP·Filed 2004·Granted Nov 13, 2007·12 cites·5 claims
- 0973US6911268B2High strength hot-dip galvanized or galvannealed steel sheet having improved plating adhesion and press formability and process for producing the sameNIPPON STEEL CORP·Filed 2001·Granted Jun 28, 2005·32 cites·9 claims
- 1071US8039390B2Method of manufacturing semiconductor deviceROHM CO LTD·Filed 2009·Granted Oct 18, 2011·3 cites·13 claims
- 1170US11764130B2Semiconductor deviceROHM CO LTD·Filed 2022·Granted Sep 19, 2023·0 cites·16 claims
- 1270US11404375B2Terminal configuration and semiconductor deviceROHM CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·19 claims
- 1361US6562152B2High strength steel plate having improved workability and plating adhesion and process for producing the sameNIPPON STEEL CORP·Filed 2001·Granted May 13, 2003·3 cites·7 claims
- 1460US11289405B2Semiconductor deviceROHM CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·4 claims
- 1557US7695826B2Alloyed molten zinc plated steel sheet and process of production of sameNIPPON STEEL CORP·Filed 2004·Granted Apr 13, 2010·7 cites·6 claims
- 1652US2023091632A1Semiconductor device and method of manufacturing semiconductor deviceROHM CO LTD·Filed 2022·Application pending·0 cites
- 1751US9881900B2Semiconductor deviceROHM CO LTD·Filed 2016·Granted Jan 30, 2018·0 cites·19 claims
- 1849US7968210B2Aluminum type plated steel sheet and heat shrink band using the sameNIPPON STEEL CORP·Filed 2006·Granted Jun 28, 2011·0 cites·9 claims
- 1947US2022352105A1Semiconductor device, electronic component, and electronic component production methodROHM CO LTD·Filed 2020·Application pending·0 cites
- 2046US2009189282A1Semiconductor deviceROHM CO LTD·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →