Inventor · disambiguated record
Jeremy Alfred Theil
Also filed as: THEIL JEREMY · THEIL JEREMY A · THEIL JEREMY ALFRED
46 granted patents·27 pending applications·1,725 citations·filing 1996–2025
99Inventor score
Files withADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC26AGILENT TECHNOLOGIES INC17INVENSAS BONDING TECH INC6AVAGO TECH INT SALES PTE LID5HEWLETT PACKARD CO4
Top patents by PatentIndex Score
73 records- 0199US11804377B2Method for preparing a surface for direct-bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Oct 31, 2023·5 cites·20 claims
- 0299US11056348B2Bonding surfaces for microelectronicsINVENSAS BONDING TECH INC·Filed 2019·Granted Jul 6, 2021·154 cites·14 claims
- 0398US12266640B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Apr 1, 2025·4 cites·35 claims
- 0498US11837582B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Dec 5, 2023·14 cites·33 claims
- 0598US11764189B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 19, 2023·17 cites·30 claims
- 0698US11756880B2Interconnect structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 12, 2023·6 cites·28 claims
- 0798US11552041B2Chemical mechanical polishing for hybrid bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Jan 10, 2023·8 cites·29 claims
- 0898US11515279B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Nov 29, 2022·10 cites·22 claims
- 0998US11158606B2Molded direct bonded and interconnected stackINVENSAS BONDING TECH INC·Filed 2019·Granted Oct 26, 2021·159 cites·35 claims
- 1098US11158573B2Interconnect structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Oct 26, 2021·67 cites·26 claims
- 1198US10840205B2Chemical mechanical polishing for hybrid bondingINVENSAS BONDING TECH INC·Filed 2018·Granted Nov 17, 2020·146 cites·28 claims
- 1298US10790262B2Low temperature bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Sep 29, 2020·160 cites·13 claims
- 1397US12046571B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Jul 23, 2024·3 cites·5 claims
- 1496US12132020B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Oct 29, 2024·2 cites·4 claims
- 1596US12125784B2Interconnect structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Oct 22, 2024·2 cites·20 claims
- 1696US12100676B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 24, 2024·2 cites·13 claims
- 1796US6325977B1Optical detection system for the detection of organic moleculesAGILENT TECHNOLOGIES INC·Filed 2000·Granted Dec 4, 2001·96 cites·31 claims
- 1895US6759262B2Image sensor with pixel isolation system and manufacturing method thereforAGILENT TECHNOLOGIES INC·Filed 2001·Granted Jul 6, 2004·87 cites·20 claims
- 1990US11244916B2Low temperature bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Feb 8, 2022·4 cites·24 claims
- 2090US5886410AInterconnect structure with hard mask and low dielectric constant materialsINTEL CORP·Filed 1996·Granted Mar 23, 1999·110 cites·14 claims
- 2187US6373117B1Stacked multiple photosensor structure including independent electrical connections to each photosensorAGILENT TECHNOLOGIES INC·Filed 1999·Granted Apr 16, 2002·79 cites·23 claims
- 2287US6018187AElevated pin diode active pixel sensor including a unique interconnection structureHEWLETT PACKARD CMPANY·Filed 1998·Granted Jan 25, 2000·94 cites·15 claims
- 2387US5936261AElevated image sensor array which includes isolation between the image sensors and a unique interconnectionHEWLETT PACKARD CO·Filed 1998·Granted Aug 10, 1999·90 cites·17 claims
- 2486US2025364263A1Method for preparing a surface for direct-bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 2585US7152758B2Scented material dispense system for a hand-held deviceAVAGO TECHNOLOGIES WIRELESS IP·Filed 2004·Granted Dec 26, 2006·39 cites·21 claims
- 2684US12341018B2Method for preparing a surface for direct-bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jun 24, 2025·0 cites·16 claims
- 2784US2025096172A1Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2883US2024379539A1Interconnect structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2982US2024379607A1Chemical mechanical polishing for hybrid bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 3081US6027995AMethod for fabricating an interconnect structure with hard mask and low dielectric constant materialsINTEL CORP·Filed 1998·Granted Feb 22, 2000·59 cites·8 claims
- 3181US2025246583A1Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 3279US6396118B1Conductive mesh bias connection for an array of elevated active pixel sensorsAGILENT TECHNOLOGIES INC·Filed 2000·Granted May 28, 2002·25 cites·16 claims
- 3378US12381173B2Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interfaceADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Aug 5, 2025·0 cites·26 claims
- 3478US6215164B1Elevated image sensor array which includes isolation between uniquely shaped image sensorsAGILENT TECHNOLOGIES INC·Filed 1999·Granted Apr 10, 2001·53 cites·16 claims
- 3575US7096716B2Integration of thermal regulation and electronic fluid sensingAVAGO TECH ECBU IP SG PTE LTD·Filed 2004·Granted Aug 29, 2006·11 cites·17 claims
- 3674US6747773B2Method and structure for stub tunable resonant cavity for photonic crystalsAGILENT TECHNOLOGIES INC·Filed 2002·Granted Jun 8, 2004·14 cites·20 claims
- 3771US6387736B1Method and structure for bonding layers in a semiconductor deviceAGILENT TECHNOLOGIES INC·Filed 1999·Granted May 14, 2002·34 cites·16 claims
- 3870US6902946B2Simplified upper electrode contact structure for PIN diode active pixel sensorAGILENT TECHNOLOGIES INC·Filed 2002·Granted Jun 7, 2005·12 cites·9 claims
- 3967US6114739AElevated pin diode active pixel sensor which includes a patterned doped semiconductor electrodeAGILENT TECHNOLOGIES INC·Filed 1998·Granted Sep 5, 2000·33 cites·11 claims
- 4066US6649993B2Simplified upper electrode contact structure for PIN diode active pixel sensorAGILENT TECHNOLOGIES INC·Filed 2001·Granted Nov 18, 2003·10 cites·10 claims
- 4166US6436488B1Chemical vapor deposition method for amorphous silicon and resulting filmAGILENT TECHNOLOGIES INC·Filed 2000·Granted Aug 20, 2002·10 cites·21 claims
- 4265US7939022B2Integration of colorimetric transducers and detectorAVAGO TECHNOLOGIES GENERAL IP·Filed 2004·Granted May 10, 2011·5 cites·12 claims
- 4365US6051867AInterlayer dielectric for passivation of an elevated integrated circuit sensor structureHEWLETT PACKARD CO·Filed 1999·Granted Apr 18, 2000·29 cites·9 claims
- 4463US2025112119A1Distribution of cooling across multiple substrates or dieAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 4563US2025191999A1Structures and methods to provide connections across channelsAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 4662US2025329611A1Structure and methods for optimizing through substrate vias and cooling channels in a composite substrateAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 4760US6786968B2Method for low temperature photonic crystal structuresAGILENT TECHNOLOGIES INC·Filed 2002·Granted Sep 7, 2004·6 cites·30 claims
- 4860US2025006679A1Conductive materials for direct bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 4959US6016011AMethod and apparatus for a dual-inlaid damascene contact to sensorHEWLETT PACKARD CO·Filed 1999·Granted Jan 18, 2000·24 cites·12 claims
- 5058US2025087560A1Structures and methods to maximize contact density across cavitiesAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
Showing the top 50 of 73 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →