Inventor · disambiguated record
Mitsuyoshi Hamada
Also filed as: HAMADA MITSUYOSHI
6 granted patents·3 pending applications·4 citations·filing 2004–2017
71Inventor score
Top patents by PatentIndex Score
9 records- 0170US9387608B2Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin compositionKOTANI HAYATO·Filed 2007·Granted Jul 12, 2016·2 cites·20 claims
- 0264US10381533B2Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflectionHITACHI CHEMICAL CO LTD·Filed 2016·Granted Aug 13, 2019·0 cites·14 claims
- 0362US10662315B2Epoxy resin molding material for sealing and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted May 26, 2020·0 cites·4 claims
- 0457US7838671B2Nitrogen-containing organosilicon compound method of manufacture, and method of treating surfacesDOW CORNING TORAY CO LTD·Filed 2007·Granted Nov 23, 2010·0 cites·4 claims
- 0548US8084130B2Epoxy resin molding material for sealing and electronic component deviceHAMADA MITSUYOSHI·Filed 2007·Granted Dec 27, 2011·2 cites·14 claims
- 0646US7326800B2Nitrogen-containing organosilicon compound, method of manufacture, and method of treating surfacesDOW CORNING TORAY CO LTD·Filed 2004·Granted Feb 5, 2008·0 cites·4 claims
- 0739US2014128505A1Epoxy resin molding material for sealing and electronic component deviceHAMADA MITSUYOSHI·Filed 2012·Application pending·0 cites
- 0835US2009012233A1Epoxy Resin Molding Material for Sealing and Electronic Component DeviceHAMADA MITSUYOSHI·Filed 2007·Application pending·0 cites
- 0934US2009247670A1Epoxy Resin Molding Material for Sealing, and Electronic Component DeviceHAMADA MITSUYOSHI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →