Inventor · disambiguated record
Young Hy Jung
Also filed as: JUNG YOUNG HY
3 granted patents·2 pending applications·21 citations·filing 2006–2021
65Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0189US11450587B2Heat removal mechanism for stack-based electronic device with process control component and processing componentsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Sep 20, 2022·2 cites·15 claims
- 0280US7652362B2Semiconductor package stack with through-via connectionHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Jan 26, 2010·16 cites·8 claims
- 0359US8024857B2Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Sep 27, 2011·3 cites·27 claims
- 0440US2009096076A1Stacked semiconductor package without reduction in stata storage capacity and method for manufacturing the sameJUNG YOUNG HY·Filed 2007·Application pending·0 cites
- 0538US2012115278A1Stacked semiconductor package without reduction in data storage capacity and method for manufacturing the sameJUNG YOUNG HY·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →